CMP Polishing Pad Composition for Low-Defect Planarity
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Solution Overview
Problem
Conventional polishing pads used in chemical mechanical planarization (CMP) processes suffer from dishing and polishing defects, particularly with soft pads, which are ineffective in maintaining planarity and causing electrical failures in semiconductor devices.
Innovation Solution
A polishing pad with a limited content of inorganic components, specifically magnesium, is produced using an expandable solid foaming agent to form uniform pores, minimizing defects and maintaining polishing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a soft polishing pad is used to reduce polishing defects, then polishing defects such as micro-scratches and chatter marks are reduced, but dishing increases due to the flexible nature of the soft pad
Solution Approach 1:
The invention changes the physical and chemical parameters of the polishing pad by controlling the inorganic component content (specifically magnesium) to be less than 90 ppm and adjusting the polymer composition ratios. This parameter optimization allows the pad to maintain appropriate softness for defect reduction while preventing excessive flexibility that causes dishing
Solution Approach 2:
The invention uses a composite material system consisting of polymer components (polyether polyol, polyester polyol, diisocyanate) combined with controlled inorganic additives. This composite structure enables the polishing pad to achieve both the softness needed for defect reduction and the structural stability required to maintain planarity
2Productivity
If inorganic components are contained in the polishing layer, then polishing performance is enhanced, but defects occur during the polishing process
Solution Approach 1:
The invention precisely controls the concentration parameter of inorganic components (magnesium content) to be less than 90 ppm, which is below the defect-threshold concentration. This parameter optimization maintains the beneficial polishing performance while eliminating the harmful defect-causing effects of excessive inorganic content
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents defects and maintains polishing efficiency by limiting inorganic component content and controlling pore size, ensuring uniformity and reducing dishing in semiconductor substrates.
Implementation Method 1
an expandable solid foaming agent is contained in a polishing composition for forming a polishing layer and expanded during a curing process to form a plurality of uniform pores in the polishing layer
Data Source
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AI summary
The present invention relates to a polishing pad, a method for producing the same, and a method of fabricating a semiconductor device using the same. According to the present invention, it is possible to prevent defects from occurring due to an inorganic component contained in a polishing layer during a polishing process, by limiting the content range of the inorganic component contained in the polishing layer. In addition, an unexpanded solid foaming agent is contained in a polishing composition for producing a polishing layer and is expanded during a curing process to form a plurality of uniform pores in the polishing layer, and the content range of the inorganic component contained in the polishing layer, thereby preventing defects from occurring during the polishing process.