Abrasion Apparatus TRIZ Cases
- Coated Abrasive Ridge Formation Using Modulated Magnetic Fields
Modulated magnetic fields form parallel abrasive ridges without machined molds, cutting scrap and production cost while preserving abrading performance.
- Bonded Abrasive Composition With Safer Controlled Porosity
Non-flammable, water-insoluble pore formers replace naphthalene to create consistent abrasive porosity without residue or fire risk.
- Laminate Polishing Pad Structure for Wafer NT Flatness
A compressible laminate polishing pad absorbs vacuum-groove deformation to preserve wafer nanotopography and a flat polishing surface.
- Porous Coated Abrasive Backing With Flame-Formed Openings
Flame perforation creates dense openings in thermoplastic abrasive backing, improving swarf removal and dust extraction without scrap.
- Inorganic Surface Microtexture for Durable Low Water Wettability
Fine wet-blast irregularities create durable low water wettability on inorganic surfaces without fluorine coatings while preserving transparency.
- Bonded Abrasive Porosity Using Nonflammable Pore Formers
Nonflammable pore inducers replace naphthalene in bonded abrasives, delivering clean burnout, controlled porosity, and safer kiln processing.
- Polishing Pad Window Molding for CMP Endpoint Transmittance
Temperature-controlled polyurethane molding raises polishing pad window transmittance, enabling more reliable CMP endpoint detection.
- Recycled CMP Polishing Pad With Controlled Layer Compressibility
Controlled compressibility in a reused polishing layer preserves CMP rate and uniformity while simplifying pad recycling and reducing waste.
- Bonded Abrasive Composition With Safer Pore Formers
Nonflammable pore formers replace naphthalene to create controlled porosity in bonded abrasives while preserving geometry and process safety.
- Coated Abrasive Backing Layers for Controlled Particle Tilt
Front fill roughness and coating parameters keep most abrasive particles well tilted, improving material removal with less orientation burden.
- Flexible Loop Abrasive Structure for Irregular Surface Contact
Interconnected abrasive loop heads stay coherent while flexing to keep broad contact on irregular surfaces, improving abrading quality and life.
- Water-Resin Grit Blasting for Radioactive Metal Decontamination
Water carries resin particles that strip radioactive contaminants from metal while concentrating waste in solids and suppressing airborne dust.
- CMP Polishing Pad Composition for Low-Defect Planarity
Controlling magnesium content and foamed pore uniformity in a CMP pad reduces defects and dishing while maintaining polishing efficiency.
- Low-Density CMP Polishing Pads With Uniform Pore Structure
Pre-expanded microspheres and a multi-curative blend lower CMP pad density while keeping pore size uniform for more consistent polishing.
- Curable Backing Composition for Flat, Heat-Stable Coated Abrasives
An epoxy-polythiol-(meth)acrylate backing treatment improves adhesion, resists oxygen inhibition, and prevents curling in coated abrasives.
- Diamond Polishing Sheet Composition for Uniform Repeated Finishing
A controlled diamond-to-binder ratio and intermediate layer help repeated polishing maintain smooth, uniform surfaces while limiting debris adhesion.