Recycled CMP Polishing Pad With Controlled Layer Compressibility
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Solution Overview
Problem
Existing polishing pads used in CMP processes are not effectively recyclable, leading to environmental pollution and increased complexity and cost due to the need for additional pad layers, while maintaining desired polishing performance.
Innovation Solution
A recycled polishing pad is developed with a reused polishing layer having a compressibility of 0.9% or more, featuring a groove on one side and a cushion layer, which maintains excellent polishing rate and uniformity without requiring additional pad layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If polishing pads are discarded after use, then environmental pollution occurs, but recycling attempts require additional pad layers which increase process complexity and cost
Solution Approach 1:
The patent recovers and reuses the cushion layer from discarded polishing pads, transforming waste material into a valuable resource. The reused cushion layer is combined with a new polishing layer to create a recycled polishing pad, eliminating the need to discard the entire pad and reducing environmental pollution while simplifying the recycling process
Solution Approach 2:
The polishing pad is divided into two separable components: the cushion layer and the polishing layer. This segmentation allows the cushion layer to be recovered and reused while the polishing layer is replaced, enabling selective recycling that reduces process complexity and cost compared to recycling entire pads with additional layers
2Duration of action of stationary object
If additional new pad layers are added to reused polishing pads, then recyclability is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
Instead of adding new pad layers to reused pads, the patent recovers and reuses the existing cushion layer from discarded pads. This approach improves recyclability by giving the cushion layer a second life while avoiding the additional manufacturing costs associated with producing and attaching new pad layers
Solution Approach 2:
The patent merges a reused cushion layer with a new polishing layer to create a complete recycled polishing pad. This combination leverages the value of the recovered cushion layer while providing a fresh polishing surface, achieving recyclability without the need for multiple new layers and reducing overall manufacturing cost
3Duration of action of moving object
If the polishing layer becomes thinner due to wear, then CMP process continues, but polishing performance deteriorates
Solution Approach 1:
The patent recovers the cushion layer from worn polishing pads where the polishing layer has become thin or degraded. By separating and reusing the durable cushion layer while replacing only the worn polishing layer, the system extends the overall service life of the pad assembly while maintaining reliable polishing performance through fresh polishing surfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The recycled polishing pad enhances polishing efficiency, uniformity, and reduces environmental impact by simplifying the recycling process and lowering costs, while maintaining mechanical properties and stability.
Implementation Method 1
an adhesive layer formed on the cushion layer; and a reused polishing layer attached to the adhesive layer
Data Source
AI summary
According to embodiments of the present invention, there are provided a recycled polishing pad and a process for preparing a recycled polishing pad. The recycled polishing pad comprises a cushion layer, an adhesive layer, and a reused polishing layer having a plurality of grooves on one side, and the compressibility of the reused polishing layer calculated by a specific equation is controlled within a predetermined range; thus, the polishing layer can be reused while excellent polishing rate and polishing uniformity are maintained.