CMP Polishing Pad Thickness Detection Module

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Solution Overview

Problem

The CMP process faces challenges due to polishing pad wear, which leads to thickness variations and mechanical stress weak points, potentially causing pad failure and impacting the yield and reliability of the process.

Innovation Solution

A detection module is integrated into the CMP system to measure the thickness of the polishing pad during the process, allowing for real-time adjustments of process parameters to minimize wear and prevent pad failure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the CMP process is used to planarize multi-material surfaces, then manufacturing precision is improved, but polishing pad wear increases leading to thickness variations and mechanical stress weak points

Engineering Contradiction:

Improveplanarization precisionVSAvoidpolishing pad reliability

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The system performs preliminary measurement of polishing pad thickness before the polishing operation using a detection module with optical sensors. This allows the control system to predict potential wear patterns and adjust process parameters in advance, preventing pad failure before it occurs during the polishing process

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The detection module continuously monitors polishing pad thickness during the CMP process and feeds this information back to the control system. The control system dynamically adjusts polishing parameters such as downforce, platen speed, and slurry flow rate based on real-time thickness measurements, maintaining pad reliability while ensuring manufacturing precision

Inventive Principle:

Principle #23Feedback

2Reliability

If real-time detection of polishing pad thickness is implemented, then polishing pad wear is reduced and process reliability is improved, but device complexity increases

Engineering Contradiction:

Improveprocess reliabilityVSAvoiddetection module complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The system replaces complex mechanical measurement methods with optical detection technology. The detection module uses optical sensors and light transmission principles to measure polishing pad thickness non-contactly, eliminating the need for physical contact probes or complex mechanical measurement mechanisms while maintaining high measurement accuracy

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The polishing pad itself serves as part of the detection system by transmitting light through its thickness. The pad's material properties enable the optical measurement process, and the system uses the pad's own characteristics (transparency to specific wavelengths) to perform self-diagnosis of its wear state without requiring external reference standards

Inventive Principle:

Principle #25Self-service

Data Source

PatentUS20250170688A1Chemical mechanical polishing apparatus and method

Publication Date: 2025.05.29 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

The present disclosure describes an apparatus and a method to detect a polishing pad profile during a polish process and adjust the polishing process based on the detected profile. The apparatus can include a polishing pad configured to polishing a substrate, a substrate carrier configured to hold the substrate against the polishing pad, and a detection module configured to detect a profile of the polishing pad. The detection module can include a probe configured to measure a thickness of one or more areas on the polishing pad, and a beam configured to support the probe, where the probe can be further configured to move along the beam.