CMP Pad Transport System with Liquid Receiving Tray

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Solution Overview

Problem

The existing chemical mechanical polishing (CMP) process is inefficient due to the need for a break-in process of new polishing pads within the polishing apparatus, which reduces productivity and requires manual attachment of pads, leading to contamination and increased downtime.

Innovation Solution

A system comprising a pad break-in device and a pad transporting device that performs the break-in process separately from the polishing apparatus, allowing for automated transport and attachment of the polishing pad, including a liquid receiving tray to prevent contamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the break-in process is performed inside the polishing apparatus, then the polishing pad can be prepared for use, but the productivity decreases and downtime increases

Engineering Contradiction:
Improvepolishing pad readinessVSAvoidapparatus productivity
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The system is divided into two independent parts: a pad break-in device and a polishing apparatus. The break-in process is segmented from the polishing process, allowing the pad to be prepared separately and then automatically transported to the polishing apparatus, eliminating the need to stop polishing for pad preparation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The polishing pad undergoes break-in processing in advance using the pad break-in device before being transported to the polishing apparatus. This preliminary action ensures the pad is ready for use without interrupting the polishing production flow.

Inventive Principle:
Principle #10Preliminary action

2Ease of manufacture

If manual attachment of the polishing pad is performed, then the pad can be fixed to the polishing table, but contamination occurs and time is consumed

Engineering Contradiction:
Improvepad attachment capabilityVSAvoidcontamination
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The pad attachment process is made self-service through automated mechanisms. The pad is automatically transported and attached to the polishing table by the apparatus itself, eliminating manual intervention and the associated contamination risks.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

A liquid receiving tray acts as an intermediary between the transported pad and the polishing table. This tray collects liquids during transport and prevents them from contaminating the polishing table or surrounding environment.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of operation

If the polishing pad is transported without liquid collection, then transport is simple, but liquid contamination occurs

Engineering Contradiction:
Improvetransport simplicityVSAvoidliquid contamination
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The liquid receiving tray serves as an intermediary component during pad transport. It is positioned to collect liquids that may drip from the pad during transportation, preventing contamination while adding minimal complexity to the transport mechanism.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

Liquid collection capability is added locally at the transport path where contamination risk exists, rather than requiring complete redesign of the transport system. The tray is positioned specifically under the pad transport route to intercept liquids.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20240082982A1Processing system, pad transporting apparatus, liquid-receiving apparatus, and polishing apparatus
Publication Date: 2024.03.14 EBARA CORP
  • US20240082982A1 patent drawing
  • US20240082982A1 patent drawing
  • US20240082982A1 patent drawing

AI summary

An improved apparatus for use in replacing a polishing pad is disclosed. processing system includes: a polishing device configured to polish a workpiece; a pad break-in device configured to perform a pad break-in process of a polishing pad; and a pad transporting device configured to transport a pad structure from the pad break-in device to the polishing device. The pad structure includes at least the polishing pad. The pad transporting device includes a liquid receiving tray arranged under the holding hand and configured to receive liquid dropped from the pad structure.