CMP Platen Glue Residue Removal via Fluorescent Marking
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Solution Overview
Problem
Residue glue left on the platen of a chemical mechanical planarization (CMP) tool after replacing the polishing pad can cause non-uniformity and performance degradation, as it is difficult to visually identify and remove effectively.
Innovation Solution
Incorporating a fluorescent material into the glue used to attach the polishing pad to the platen, which emits a visible light when activated by a UV light, allowing for easy identification and targeted removal of residue glue using a spot-cleaning process, either manually or through an automatic system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If residue glue is not removed after polishing pad replacement, then the polishing pad can be quickly reinstalled, but the planarity and performance of the CMP tool deteriorate
Solution Approach 1:
The patent applies preliminary action by incorporating fluorescent material into the glue before application. This allows the fluorescent marker to be pre-positioned on the platen surface, enabling rapid detection and targeted removal of residue glue in subsequent cleaning steps without requiring thorough inspection or cleaning of the entire surface.
Solution Approach 2:
The patent utilizes color changes by incorporating fluorescent material that emits visible light under UV illumination. This optical property creates a visual contrast between residue glue and the clean platen surface, enabling easy identification and selective removal of only the contaminated areas, thus maintaining high planarity while minimizing cleaning time.
2Manufacturing precision
If the entire platen surface is cleaned after polishing pad replacement, then all residue glue is removed, but cleaning time and fluid consumption increase
Solution Approach 1:
The patent applies local quality by using fluorescent material to mark only the areas where glue residue is present. This enables the cleaning process to be localized to specific contaminated regions rather than treating the entire platen surface uniformly, thereby reducing cleaning time and fluid consumption while maintaining complete removal of residue glue.
Solution Approach 2:
The fluorescent material in the glue residue essentially performs the work of identifying itself for removal. When illuminated by UV light, the fluorescent marker automatically highlights the contamination locations, eliminating the need for manual inspection or complex detection systems, and enabling operators to quickly identify and clean only the necessary areas.
3Difficulty of detecting and measuring
If fluorescent material is added to the glue, then residue glue becomes easily detectable, but the glue composition becomes more complex
Solution Approach 1:
The patent applies composite materials by combining fluorescent powder or particles with the adhesive glue matrix. This creates a composite adhesive that maintains the bonding properties of the base glue while adding the detection capability of the fluorescent material. The fluorescent component is distributed throughout the glue, ensuring consistent marking without significantly altering the glue's primary adhesive function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables complete removal of residue glue, ensuring improved planarity of the polishing pad, reducing downtime, and lowering cleaning fluid costs, thereby enhancing the efficiency and effectiveness of the CMP process.
Implementation Method 1
Incorporating a fluorescent material into the glue used to attach the polishing pad to the platen, which emits a visible light when activated by a UV light
Data Source
AI summary
A method of operating a chemical mechanical planarization (CMP) tool includes attaching a polishing pad to a first surface of a platen of the CMP tool using a glue; removing the polishing pad from the platen, wherein after removing the polishing pad, residue portions of the glue remain on the first surface of the platen; identifying locations of the residue portions of the glue on the first surface of the platen using a fluorescent material; and removing the residue portions of the glue from the first surface of the platen.