CMP Platen Temperature Control via Segmented Peltier Zones
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Solution Overview
Problem
Current chemical mechanical polishing (CMP) processes face challenges in uniformly controlling the temperature of the platen regions during the CMP process, leading to variations in polishing rates across different areas of the semiconductor substrate, which affects the planarization efficiency.
Innovation Solution
The implementation of a temperature control system that includes multiple temperature sensors and controllers to measure and individually control the actual temperatures of at least two regions of the platen in real time, ensuring they maintain a predetermined set temperature, using Peltier elements for heating and cooling, and adjusting the temperatures of the polishing pad and the slurry and deionized water accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional CMP process is used without regional temperature control, then the device complexity is low, but the manufacturing precision deteriorates due to non-uniform polishing rates across the substrate
Solution Approach 1:
The platen is divided into multiple regions (first region and second region) with independent temperature control. Temperature sensors are distributed across different regions to measure local temperatures, and heating/cooling units are positioned to provide region-specific thermal control. This segmentation enables independent temperature management for each region, resolving the non-uniform polishing issue while maintaining manageable system complexity through modular control architecture.
Solution Approach 2:
Different regions of the platen are provided with different temperature control characteristics. The first region receives different temperature control than the second region, allowing each area to be optimized for its specific polishing requirements. This local quality approach ensures that each region maintains optimal temperature for uniform polishing rates, directly addressing the manufacturing precision issue.
2Manufacturing precision
If real-time temperature measurement and control is implemented across multiple regions, then the manufacturing precision improves, but the device complexity increases due to multiple sensors and controllers
Solution Approach 1:
The temperature control system uses a unified controller that manages multiple heating and cooling units across different regions. The controller integrates temperature measurement data from multiple sensors and coordinates control actions across the entire platen surface. This multi-functionality approach allows a single controller to manage the complex multi-region temperature control, reducing the need for separate controllers in each region and thereby managing device complexity while maintaining high temperature control precision.
Solution Approach 2:
Temperature sensors in each region provide real-time feedback to the controller about local temperature conditions. The controller uses this feedback information to adjust heating and cooling unit operations dynamically, ensuring each region maintains its target temperature. This feedback mechanism enables precise temperature control across multiple regions without requiring overly complex manual control systems, as the automated feedback loop handles the complexity of coordinating multiple control elements.
3Productivity
If the platen temperature is not controlled uniformly, then the ease of operation is high, but the productivity deteriorates due to reduced planarization efficiency
Solution Approach 1:
The temperature control system operates autonomously using self-service principles. Temperature sensors continuously monitor platen temperature distribution, and the controller automatically adjusts heating and cooling units based on measured conditions without requiring manual intervention. The system self-regulates to maintain optimal temperature uniformity across the platen, enabling high planarization efficiency while keeping the operation simple and automated, thus maintaining ease of operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures uniform polishing rates across the substrate, particularly improving the edge portion polishing and enhances the efficiency of the CMP process by maintaining precise temperature control, thereby improving the planarization of semiconductor substrates.
Implementation Method 1
a plurality of first temperature sensors configured to measure actual temperatures of at least two regions in a platen in real time during the CMP process
Implementation Method 2
using Peltier elements for heating and cooling
Implementation Method 3
adjusting the temperatures of the polishing pad and the slurry and deionized water accordingly
Data Source
AI summary
A method of controlling a chemical mechanical polishing (CMP) process, a temperature control, and a CMP apparatus, the method including measuring actual temperatures of at least two regions in a platen in real time during the CMP process in which a polishing pad attached to the platen polishes a substrate held by a polishing head using slurry and deionized water; receiving the measured actual temperatures of the regions; and individually controlling the actual temperatures of the regions in real time during the CMP process to provide the regions with a predetermined set CMP process temperature.