CMP Polishing Behavior Analysis via Virtual Simulation
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Solution Overview
Problem
Current methods for analyzing polishing behavior in semiconductor wafer CMP processes struggle to directly calculate polishing results based on the mutual sliding behaviors between the pad and wafer, limiting the discovery of optimal conditions for uniform polishing and pad abrasion.
Innovation Solution
A method and device that analyze polishing behavior by setting up equipment shape, operation, and calculation variables for the pad and wafer, generating calculation nodes to calculate sliding distances and angles, and outputting results in numeric and graphical formats, including sliding distance distribution images and trajectory analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If laser measurement devices or sensors are attached to detect and analyze polishing behavior, then measurement capability is improved, but device complexity and cost increase
Solution Approach 1:
The patent creates a virtual copy of the polishing system through computer simulation. Instead of attaching physical sensors to the actual CMP equipment, the invention generates a digital model that replicates the polishing behavior, pad-wafer interaction, and sliding dynamics. This virtual copy allows comprehensive measurement and analysis without modifying the physical equipment, thereby maintaining measurement precision while avoiding increased device complexity and cost.
2Measurement precision
If physical sensors are attached to the pad or wafer to measure sliding behavior, then measurement accuracy is improved, but the polishing process complexity increases
Solution Approach 1:
The patent replaces the mechanical sensor-based measurement system with a computational model. The simulation software calculates sliding distances, contact pressures, and polishing rates by solving the mathematical relationships between pad and wafer motion without requiring physical sensors. This substitution eliminates the need for additional measurement hardware and the complexity of integrating and calibrating sensors during the polishing process.
3Loss of information
If comprehensive measurement systems are implemented to analyze mutual sliding behaviors, then analysis capability is improved, but ease of operation deteriorates
Solution Approach 1:
The simulation software performs self-service by automatically calculating all necessary polishing parameters based on the input process conditions. The system autonomously computes sliding distances, contact forces, pressure distributions, and polishing rates without requiring manual measurement or complex data collection procedures. Users simply input basic process parameters, and the software generates comprehensive analysis results, making the system easy to operate while providing complete polishing behavior information.
Data Source
AI summary
Disclosed herein are a method for analyzing polishing behavior and a device for the same. Herein, the method corresponds to a method for analyzing polishing behavior of a device for analyzing polishing behavior by at least one processor including the steps of setting up equipment shape variables, operation variables, and calculation variables corresponding to at least one configuration element being selected from one of a pad and a wafer, the pad and the wafer configuring a polishing device, generating calculation nodes based on the equipment shape variables, the operation variables, and the calculation variables, calculating a sliding distance on a wafer surface caused by the pad or a sliding distance on a pad surface caused by the wafer by using the calculation node, and outputting the calculated result.