CMP Polishing Pad Window Leakage Prevention via Segmented Adhesive

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Solution Overview

Problem

The existing chemical mechanical planarization (CMP) processes in semiconductor manufacturing face challenges in maintaining long-term durability and preventing moisture leakage, especially when used for extended periods, which can affect the quality and efficiency of the polishing process.

Innovation Solution

A polishing pad with a window for endpoint detection is designed, featuring a multi-stage adhesive layer structure, a compressed region in the support layer, and a barrier layer to minimize liquid leakage between the window and the polishing pad, ensuring excellent durability and process efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a window is disposed in the polishing pad for endpoint detection, then measurement precision is improved, but moisture leakage occurs through the interface between the window and polishing pad, worsening reliability

Engineering Contradiction:

Improveendpoint detectionVSAvoidmoisture leakage prevention

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The sealing structure is divided into multiple segments: a first adhesive layer for basic adhesion, a barrier layer for moisture blocking, and a second adhesive layer for additional sealing. This segmented approach addresses the leakage issue at different levels while maintaining the window opening for endpoint detection.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The sealing structure uses composite materials with different functions: adhesive layers for bonding and moisture resistance, and a barrier layer specifically for blocking moisture permeation. This composite structure prevents leakage through the window interface while maintaining detection functionality.

Inventive Principle:

Principle #40Composite materials

2Productivity

If the polishing pad is used for extended periods, then productivity is maintained, but durability decreases due to moisture leakage and interface degradation

Engineering Contradiction:

Improvepolishing process continuityVSAvoidpolishing pad durability

Core Design Contradiction:

ProductivityVSDuration of action of stationary object

Solution Approach 1:

The multi-layer sealing structure is installed beforehand to prevent moisture leakage before it can cause damage. The barrier layer and adhesive layers work together to cushion against moisture permeation at the window interface, ensuring long-term durability and continuous productivity without degradation.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Ease of manufacture

If a simple adhesive structure is used at the window interface, then ease of manufacture is improved, but moisture leakage occurs, worsening reliability

Engineering Contradiction:

Improvewindow installationVSAvoidleakage prevention

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The sealing structure is segmented into multiple functional layers that can be applied in a systematic manufacturing process. The first adhesive layer, barrier layer, and second adhesive layer are applied sequentially, making the manufacturing process manageable while achieving reliable leakage prevention.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents moisture leakage and enhances the long-term durability of the polishing pad, improving polishing rate, flatness, and defect prevention, thereby securing high-quality semiconductor device manufacturing.

Implementation Method 1

a first adhesive layer is included between the lowermost end surface of the window and the third surface

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

a barrier layer is included on one surface of the second adhesive layer, and between the lowermost end surface of the window and the third surface

Methodology Applied

Scientific EffectBarrier layer:

Implementation Method 3

the support layer includes a compressed region in a region corresponding to the lowermost end surface of the window

Methodology Applied

Scientific EffectCompression: Compression

Implementation Method 4

a second adhesive layer is included between the second surface and the third surface

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20230197482A1Polishing pad and method for manufacturing semiconductor device using same

Publication Date: 2023.06.22 SK ENPULSE CO LTD

AI summary

Through a combination of a multi-stage adhesive layer structure, a compressed region structure, and a barrier layer, the polishing pad according to the present disclosure can minimize the leakage of liquid components flowing through the interface between the window and the polishing pad and realize excellent long-term durability without leakage even when substantially applied to a polishing process for a long time. In the method for manufacturing a semiconductor device, the specific structure having the window of the polishing pad applied thereto as described above is combined with the optimal process conditions related to the polishing process so that the process efficiency can be further improved, and excellent quality can be secured in terms of polishing rate, polishing flatness, defect prevention, and the like.