CMP Retainer Ring Segmented Coupling and Sealing

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Solution Overview

Problem

The existing retainer rings for chemical-mechanical polishing apparatuses face issues with reliable mounting, leading to vibrations and scratches on semiconductor wafers, and the bonding material often leaks, causing further damage during polishing operations.

Innovation Solution

A retainer ring design featuring a first ring body with engagement holes and a second ring body with corresponding recesses, secured by fixing members and bonding parts, along with O-rings for sealing, to ensure firm assembly and prevent leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the first ring body is formed of a metal material and increased in thickness to obtain preset weight and height, then the weight and height specifications are met, but the bonding force of the second ring body decreases, leading to unreliable support and potential wafer damage

Engineering Contradiction:

Improveweight and height specificationsVSAvoidbonding force

Core Design Contradiction:

Manufacturing precisionVSStrength

Solution Approach 1:

The retainer ring is divided into a first ring body (metal) and a second ring body (engineering plastic) that are coupled together but can be separately manufactured and assembled. This segmentation allows the first ring body to provide the required weight and height while the second ring body provides the bonding surface, resolving the contradiction between thickness requirements and bonding strength.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The retainer ring uses a composite structure combining metal (first ring body) and engineering plastic (second ring body). The metal portion provides mechanical strength and dimensional specifications, while the plastic portion provides excellent bonding characteristics, thereby achieving both weight/height requirements and strong bonding force simultaneously.

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If the first ring body and second ring body are coupled and integrated by bonding using an adhesive, then the assembly is simple, but the bonding material frequently leaks to the outer circumference, forming scratches on the wafer surface

Engineering Contradiction:

Improveassembly simplicityVSAvoidbonding material leakage

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

An O-ring (flexible sealing element) is introduced between the first and second ring bodies to create a seal that prevents bonding material from leaking to the outer circumference. The O-ring maintains the simple assembly process while eliminating the harmful leakage effect that causes wafer scratches.

Inventive Principle:

Principle #30Flexible shells and thin films

3Ease of operation

If only the first ring body is fastened with bolts to the polishing head, then the mounting is simple, but the bonding force of the second ring body portions decreases, failing to reliably support the semiconductor wafer

Engineering Contradiction:

Improvemounting simplicityVSAvoidwafer support reliability

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The mounting mechanism combines two approaches: the first ring body is fastened to the polishing head with bolts (mechanical fastening), and the second ring body is bonded to the first ring body (adhesive bonding). This merged approach maintains simple mounting operations while significantly improving wafer support reliability through the combined strength of both fastening and bonding.

Inventive Principle:

Principle #5Merging (Combining)

4Ease of manufacture

If the retainer ring is fabricated by bonding the first ring body and second ring body, then the fabrication is straightforward, but vibrations occur due to insufficient bonding force, and accidents frequently occur during polishing operations

Engineering Contradiction:

Improvefabrication straightforwardnessVSAvoidstructural stability

Core Design Contradiction:

Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The composite structure of metal first ring body and engineering plastic second ring body, combined with proper bonding techniques, creates a structurally stable assembly that resists vibrations during polishing operations while maintaining straightforward fabrication processes.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The O-ring sealing element not only prevents bonding material leakage but also enhances the structural stability of the assembled retainer ring by providing additional mechanical interlocking and sealing between the two ring bodies, thereby reducing vibrations during operation.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS9827647B2Retainer ring for chemical-mechanical polishing device

Publication Date: 2017.11.28 WILL BE S & T

AI summary

A retainer ring for a chemical-mechanical polishing device. The ring prevents damage that occur during polishing work and being usable in stable fashion up until a predetermined lifespan has elapsed, by ensuring that a first ring body mounted on the chemical-mechanical polishing device and a second ring body making contact with a polishing pad are firmly coupled together by means of securing bodies which pass through coupling holes in the first ring body and are coupled to recessed coupling parts in the second ring body, and also by means of adhesive parts which are provided in the coupling holes or the recessed coupling parts and adhere and secure the securing bodies.