CMP Rotary Body Module with Independent Magnetic Tilt Control
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Solution Overview
Problem
The chemical mechanical polishing process in semiconductor manufacturing often faces reliability issues due to the inability to maintain the horizontal position of wafers and retainer rings, especially with high integration and large aperture of semiconductor devices.
Innovation Solution
A chemical mechanical polishing apparatus with a rotary body module that includes independently tiltable first and second rotating units, each equipped with a magnet or electromagnet driving member, allowing precise control of the wafer and retainer ring positions through magnetic forces and displacement sensors to maintain horizontal alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional CMP apparatus uses a single rotating unit for both wafer and retainer ring, then the structure is simple, but the horizontal positions of wafer and retainer ring cannot be independently maintained
Solution Approach 1:
The rotary body is segmented into a first rotating unit (holding the wafer) and a second rotating unit (holding the retainer ring), allowing independent control of each unit's horizontal position through separate driving members, thus resolving the contradiction between maintaining planarization reliability and avoiding excessive structural complexity
Solution Approach 2:
The patent introduces tilting mechanisms with driving members that enable dynamic adjustment of the horizontal positions of both rotating units independently, transforming a static single-unit structure into a dynamic multi-unit system that can adapt to maintain reliability without excessive complexity
2Productivity
If the wafer aperture is increased for high integration, then more devices can be polished, but the wafer becomes more difficult to keep horizontal
Solution Approach 1:
The first rotating unit is equipped with a tilting mechanism and driving member that enable dynamic adjustment of the wafer's horizontal position, allowing large aperture wafers to be kept horizontal during polishing, thus resolving the contradiction between increasing productivity through larger wafers and maintaining reliability of horizontal position stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables independent and precise maintenance of the horizontal positions of wafers and retainer rings during the polishing process, enhancing the reliability and effectiveness of the CMP process.
Implementation Method 1
the first and second driving members are comprised of a magnet or an electromagnet, wherein a first magnet, disposed opposite to the first driving member, is provided in the first rotating unit, and a second magnet, disposed opposite to the second driving member, is provided in the second rotating unit
Data Source
AI summary
A chemical mechanical polishing apparatus includes a fixing portion; and a rotary body module including a rotating shaft rotatably installed on the fixing portion, a first rotating unit connected to the rotating shaft and on which a wafer is mounted, and a second rotating unit disposed around the first rotating unit and on which a retainer ring is mounted, wherein the fixing portion comprises a first driving member disposed above the first rotating unit and a second driving member disposed above the second rotating unit, wherein the first and second driving members are comprised of a magnet or an electromagnet, wherein a first magnet, disposed opposite to the first driving member, is provided in the first rotating unit, and a second magnet, disposed opposite to the second driving member, is provided in the second rotating unit, and wherein the first rotating unit and the second rotating unit are independently tilted.