CMP Smart Head Seal Ring Groove Radii for Edge Uniformity

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Solution Overview

Problem

Existing CMP systems face challenges in uniformly processing substrates near the edges, leading to inefficiencies and increased costs due to wear on internal components.

Innovation Solution

The apparatus includes a distal force assembly with a bladder seal, a seal ring, and a transfer ring, featuring grooves with specific radii to distribute pressure uniformly and reduce wear.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional CMP systems are used, then substrate polishing can be performed, but uniform processing near edges is poor and component wear increases

Engineering Contradiction:

Improveuniformity of substrate processingVSAvoidwear on internal components

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The seal ring incorporates localized structural features (plateau radius and ridge radius) at specific locations to distribute pressure uniformly across the substrate edge region. The plateau region provides a larger contact area for reduced pressure, while the ridge region provides structural support, creating non-uniform local properties that achieve uniform overall pressure distribution.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The grooves in the seal ring are designed with specific radii (plateau radius and ridge radius between 0.012 to 0.018 inches) that create curved transition zones. These curved geometries allow for smooth pressure distribution across the substrate edge, avoiding sharp stress concentrations that would cause non-uniform processing and accelerated wear.

Inventive Principle:

Principle #14Spheroidality (Curvature)

2Productivity

If conventional carrier designs are used, then substrate retention is achieved, but manufacturing efficiency decreases due to increased wear

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidservice life of carrier components

Core Design Contradiction:

ProductivityVSDuration of action of stationary object

Solution Approach 1:

The seal ring design changes the geometric parameters (radii values) to optimize the balance between substrate retention capability and component wear resistance. By controlling the plateau and ridge radii within specific ranges, the design maintains effective substrate retention while reducing stress concentrations that lead to wear.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The distal force assembly combines different material properties in the seal ring structure, utilizing the plateau region for pressure distribution and the ridge region for structural reinforcement. This composite-like structure within a single component achieves both soft contact for uniform pressure and hard support for wear resistance.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS20250100105A1CMP inner ring in smart head

Publication Date: 2025.03.27 APPLIED MATERIALS INC

AI summary

The disclosure provides an apparatus for substrate polishing, the apparatus includes a housing member, a carrier member, and a distal force assembly. The carrier member is coupled to and disposed radially outward of the housing member. The distal force assembly disposed radially inward of an exterior portion of the carrier member and radially outward of the housing member. The distal force assembly includes a bladder seal, a seal ring in contact with the bladder seal. The seal ring has a seal ring face and one or more grooves disposed therein. The grooves include a plateau radius and a ridge radius disposed opposite the plateau radius at an intersection between the seal ring face and the grooves, wherein the plateau radius and the ridge radius are between about 0.012 to about 0.018 inches. The distal force assembly also includes a transfer ring coupled to the seal ring opposite the bladder.