CMP Sensor Array for Spatial Pressure Measurement
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Solution Overview
Problem
Current semiconductor manufacturing processes, particularly Chemical Mechanical Planarization (CMP), face challenges in accurately measuring and controlling localized pressure distributions and trajectories on wafer surfaces, which affects the quality and uniformity of the planarization process.
Innovation Solution
A sensor apparatus is designed to measure pressure and temperature distributions and trajectories during CMP processes, comprising a contact plate, sensors, a base, and electronics, which are configured to mimic the mechanical and chemical properties of semiconductor wafers, allowing for precise data collection and transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single control sensor is used to measure process parameters at a specific location, then the device complexity is reduced, but the measurement precision and ability to capture spatially varying conditions deteriorates
Solution Approach 1:
The patent divides the measurement system into multiple independent sensing elements arranged in an array across the workpiece surface. Each sensor measures local conditions independently, enabling spatial mapping of process parameters such as pressure, temperature, or composition variations across different locations on the workpiece during processing
Solution Approach 2:
The patent transitions from single-point measurement to two-dimensional spatial measurement by arranging sensors in a grid or array pattern across the workpiece surface. This adds the spatial dimension to measurements, allowing capture of gradients and variations in process conditions across the workpiece area rather than at a single location
2Measurement precision
If multiple sensors are used to measure process conditions at different locations, then the measurement precision improves, but the device complexity increases
Solution Approach 1:
The patent designs a universal sensor array platform that can measure multiple process parameters (pressure, temperature, composition) using the same physical structure. The sensor array can be configured for different measurement types and workpiece sizes, reducing overall system complexity through multi-functionality while maintaining high measurement precision across multiple locations
3Reliability
If process conditions are monitored continuously, then the reliability of process control improves, but the loss of time for data processing and analysis increases
Solution Approach 1:
The patent implements real-time feedback control by continuously monitoring process parameters across the workpiece surface and immediately comparing measurements against target values. The system automatically adjusts process conditions based on detected variations, maintaining reliable process control while minimizing manual intervention and data processing time through automated closed-loop control
Data Source
AI summary
Some problems related to processing workpieces are presented along with solutions to one or more of the problems. One embodiment of the invention comprises a sensor apparatus for collecting data representing one or more process conditions used for processing a workpiece. Another embodiment of the present invention is a combination comprising a sensor apparatus and a process tool for applications such as chemical mechanical planarization of workpieces and chemical mechanical polishing of workpieces.