CMP Slurry Circulation and Pad Cleaning Separation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for recovering and reusing chemical mechanical polishing (CMP) slurry are costly and require complex processing, such as adding solvents and chemicals, while disposal methods lead to environmental issues and increased costs due to waste generation.
Innovation Solution
A surface processing method that includes circulating slurry through a dedicated flow channel for supply and recovery, separating cleaning solution discharge from slurry recovery, and using the used slurry without additional treatments, with controlled chemical and mechanical actions to planarize a workpiece surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If conventional slurry recovery methods are used to reuse slurry, then cost reduction is achieved through waste reduction, but processing complexity increases due to requiring solvent addition and chemical treatment
Solution Approach 1:
The invention extracts and removes polishing target particles from the slurry through filtration, separating the reusable abrasive components from the waste polishing target material. This extraction process enables slurry reuse without requiring complex chemical treatments or solvent additions, as the filtration system directly removes contaminants physically.
Solution Approach 2:
The invention implements a system that discards polishing target particles through filtration while recovering and reusing the abrasive grains in the slurry. The filtration unit continuously removes polishing target particles from the circulation flow, enabling prolonged slurry life and reduced waste without complex processing steps.
2Device complexity
If slurry circulation is maintained without separation from cleaning solution, then system simplicity is preserved, but processing quality deteriorates due to contamination from cleaning residues
Solution Approach 1:
The invention segments the flow channel system into distinct circulation and cleaning pathways. The circulation flow channel maintains slurry flow for continuous polishing operations, while the cleaning solution flow channel separately introduces cleaning solution to the filtration unit. This segmentation prevents mixing between slurry and cleaning solution, ensuring processing quality without requiring complex additional separation equipment.
Solution Approach 2:
The filtration unit serves as an intermediary component that handles both slurry circulation and cleaning solution processing. It filters polishing target particles from the slurry while also receiving and disposing of cleaning solution separately through the waste liquid discharge flow channel. This intermediary function enables quality maintenance without complicating the overall system architecture.
3Device complexity
If cleaning solution is discharged through the same flow channel as slurry recovery, then system simplicity is maintained, but substance loss increases due to mixing clean and waste liquids
Solution Approach 1:
The invention segments the discharge system into separate waste liquid discharge and slurry recovery pathways. The waste liquid discharge flow channel is configured to receive and discharge cleaning solution separately from the slurry circulation system. This segmentation prevents mixing of clean and waste liquids, reducing substance loss without requiring complex additional discharge equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient reuse of slurry without additional treatments, maintaining high processing quality and efficiency for extended periods, reducing costs and environmental impact.
Implementation Method 1
the slurry circulates through a circulation flow channel (R) for the slurry, which includes a slurry supply flow channel (63) that supplies the slurry to the processing pad and a slurry recovery flow channel (652) that recovers the slurry after use
Implementation Method 2
dissolving polishing target particles (i.e., abraded matters) among polishing target components contained in the slurry
Implementation Method 3
collecting abrasive by filtering the slurry
Implementation Method 4
cleaning the processing pad with a cleaning solution (L)
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A surface processing method according to the present disclosure includes: supplying slurry (S) containing at least abrasive grains between a processing surface (W1) of a workpiece (W) and a processing pad (3); planarizing the processing surface of the workpiece through chemical and mechanical actions by moving the workpiece and the processing pad relative to each other with the slurry interposed between the processing surface of the workpiece and the processing pad; and cleaning the processing pad with a cleaning solution (L). In this method, during the planarization process, the slurry circulates through a circulation flow channel (R) for the slurry, which includes a slurry supply flow channel (63) that supplies the slurry to the processing pad and a slurry recovery flow channel (652) that recovers the slurry after use. When the processing pad is cleaned with the cleaning solution, the cleaning solution is discharged through a waste liquid flow channel (653), which is separate from the circulation flow channel, allowing liquid waste to flow through the waste liquid flow channel.