CMP Slurry Composition for Fine-Pore Filterability and Surface Quality

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Solution Overview

Problem

Chemical-mechanical polishing compositions containing hydroxyethyl cellulose (HEC) experience reduced filterability after dilution, making it difficult to use filters with smaller pore diameters, which hinders the improvement of substrate surface quality.

Innovation Solution

The use of HEC with a low weight average molecular weight (200,000 or less) in combination with a surfactant, such as a nonionic surfactant, improves the POU filter filterability of the polishing composition even after dilution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If HEC is used in polishing composition to enhance wettability and maintain hydrophilicity, then surface quality is improved, but filterability is reduced after dilution

Engineering Contradiction:
Improvesurface qualityVSAvoidfilterability
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent changes the molecular weight parameter of HEC from conventional high values to 200,000 or less, which fundamentally alters the polymer's physical properties. This parameter change reduces viscosity and improves filterability after dilution while maintaining the wettability enhancement function on substrate surfaces.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite system by combining low molecular weight HEC with specific additives including basic compounds (ammonia, potassium hydroxide, sodium hydroxide) and chelating agents. This composite formulation synergistically improves both surface quality and filterability, as the additives compensate for any potential loss in polishing performance from the lower molecular weight polymer.

Inventive Principle:
Principle #40Composite materials

2Reliability

If HEC is used in polishing composition, then interaction between substrate and slurry is enhanced, but POU filter filterability is reduced after dilution

Engineering Contradiction:
Improveinteraction between substrate and slurryVSAvoidPOU filter filterability
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

By changing the molecular weight parameter of HEC to 200,000 or less, the patent maintains sufficient polymer-chain interaction with the substrate surface while reducing the solution's tendency to clog filters. The lower molecular weight allows better penetration and distribution in the filtration system after dilution.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces basic compounds and chelating agents as intermediary substances that mediate between the HEC polymer and the filtration process. These additives modify the slurry's overall behavior, preventing filter clogging while allowing the HEC to maintain its substrate interaction function.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If smaller pore diameter filters are used to improve surface quality, then surface defects are reduced, but filterability of HEC-containing composition is insufficient

Engineering Contradiction:
Improvesurface defectsVSAvoidfilterability
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent's parameter change of using HEC with molecular weight of 200,000 or less directly enables the use of smaller pore diameter filters. The lower molecular weight polymer creates a less viscous, more filterable slurry that can pass through fine-pore filters without excessive clogging, thereby enabling the use of filters that can remove smaller particles and defects.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent performs preliminary filtration using the improved HEC formulation before the polishing process. By ensuring the slurry is pre-filtered through smaller pore diameter filters made possible by the low molecular weight HEC, aggregates and impurities are removed in advance, preventing surface defects during polishing.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the surface quality of substrates by maintaining high POU filter filterability, allowing for effective filtration with smaller pore diameter filters, and reducing surface defects and haze.

Implementation Method 1

hydroxyethyl cellulose (HEC) is used as a water-soluble polymer for the purpose of enhancing wettability of the substrate surface in addition to an abrasive such as silica or a basic compound such as ammonia

Methodology Applied
Scientific EffectAdsorption: Adsorption

Implementation Method 2

The use of HEC with a low weight average molecular weight (200,000 or less) in combination with a surfactant, such as a nonionic surfactant, improves the POU filter filterability of the polishing composition even after dilution

Methodology Applied
Scientific EffectSurfactant: Surfactant

Data Source

PatentEP4074792B1Chemical-mechanical polishing composition and chemical-mechanical polishing method in which same is used
Publication Date: 2025.04.02 ENTEGRIS INC
  • EP4074792B1 patent drawingFigure 1
  • EP4074792B1 patent drawingFigure 2
  • EP4074792B1 patent drawingFigure 3

AI summary

The chemical-mechanical polishing composition of the present invention is for polishing a substrate and contains an abrasive, a hydroxyethyl cellulose having a weight average molecular weight of 200,000 or less, a basic component, a surfactant, and an aqueous carrier.