CMP Slurry Spray Nozzles for Uniform Removal With Lower Fluid Use
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Solution Overview
Problem
Conventional chemical mechanical polishing (CMP) systems face challenges in uniformly dispensing polishing fluid, leading to uneven material removal profiles and excessive fluid consumption due to continuous high flow rates, which result in wasted fluid and reduced pad lifetime.
Innovation Solution
A method and apparatus that utilize a fluid delivery assembly with adjustable nozzles capable of pulsing fluid at variable flow rates, allowing for independent control of fluid dispensing at different radial positions on the polishing pad, reducing fluid usage by up to 50% compared to conventional systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If continuous high flow rate fluid dispensing is used, then uniform material removal is achieved, but fluid consumption increases excessively
Solution Approach 1:
The patent applies periodic action by pulsing the fluid delivery at controlled frequencies and duty cycles. The fluid is delivered in periodic pulses rather than continuous flow, with the frequency and duty cycle adjusted based on substrate position and polishing requirements. This periodic delivery maintains effective material removal while significantly reducing overall fluid consumption compared to continuous high flow rate dispensing.
Solution Approach 2:
The patent implements dynamics by making the fluid flow rate variable rather than fixed. The system dynamically adjusts the flow rate based on real-time conditions including substrate position, carrier assembly location, and polishing pad zone. This dynamic adaptation allows optimal fluid delivery at each moment while minimizing total fluid usage.
2Loss of substance
If low flow rate fluid dispensing is used, then fluid consumption is reduced, but uniform fluid distribution becomes difficult to achieve
Solution Approach 1:
The patent applies local quality by delivering fluid at different flow rates to different locations on the polishing pad. The system adjusts fluid delivery based on the specific zone being polished, carrier assembly position, and substrate location. This localized adaptation ensures each area receives appropriate fluid quantity for uniform distribution while minimizing overall consumption.
Solution Approach 2:
The patent implements parameter changes by varying multiple fluid delivery parameters including flow rate, frequency, and duty cycle. These parameters are dynamically adjusted based on polishing conditions, substrate position, and pad zone characteristics. This multi-parameter control enables uniform fluid distribution at reduced flow rates compared to conventional single-parameter systems.
3Loss of substance
If variable flow rate pulsing is implemented, then fluid consumption is reduced, but system complexity increases
Solution Approach 1:
The patent applies feedback by using sensors to detect substrate position, carrier assembly location, and polishing pad zone characteristics. This feedback information is used to dynamically adjust fluid delivery parameters including flow rate, frequency, and duty cycle. The feedback control enables reduced fluid consumption through intelligent pulsing while managing system complexity through automated closed-loop control.
4Productivity
If fluid accumulates near substrate edge, then edge material removal rate increases, but overall uniformity deteriorates
Solution Approach 1:
The patent applies local quality by delivering fluid at different rates to different radial zones of the polishing pad. The system specifically controls fluid delivery to prevent excessive accumulation at the substrate edge while ensuring adequate coverage of the polishing area. This localized control maintains edge removal rates while improving overall uniformity of the material removal profile.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform fluid distribution across the polishing pad, reducing fluid consumption while maintaining effective material removal rates and extending the life of the polishing pad by optimizing fluid delivery to specific zones, thereby minimizing defects and fluid waste.
Implementation Method 1
one or more fan jet nozzles configured to dispense pressurized fluid having a flat fan jet shape
Implementation Method 2
Each nozzle is coupled to a fast actuating valve
Data Source
AI summary
Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP apparatus for processing a substrate including a pad disposed on a platen. The pad has a pad radius and a central axis from which the pad radius extends. The apparatus also include a carrier assembly configured to be disposed on a surface of the pad and having a carrier radius that extends from a rotational axis of the carrier assembly and a fluid delivery assembly comprising one or more nozzles, each nozzle coupled to a fast actuating valve.