Lapping Machines TRIZ Cases
- Lapping Head Fixing and Optical Wear Detection for CMP
A bearing disk fixture and optical detector measure CMP lapping head curves and groove depth without caliper damage or wear-assessment error.
- Interconnect CMP with Protected Noble Metal Liner Removal
A two-step CMP sequence uses oxidant-driven liner removal and conductive-layer protection to avoid shorts, opens, and metal damage.
- Substrate Cleaning Load Feedback for Precise Wafer Contact
Closed-loop load control adjusts cleaning member contact in steps to keep wafer pressing force accurate and reduce cleaning defects.
- CMP Slurry Temperature Control for Uniform Wafer Polishing
A TE-chip slurry control approach cools or heats CMP abrasive slurry to stabilize removal rate and reduce dishing or erosion.
- Substrate Cleaning Feedback Control for Precise Pressing Load
Closed-loop force measurement adjusts cleaning member pressing amount by threshold steps to improve substrate cleaning precision and throughput.
- CMP Slurry Distribution Barriers for Uniform Pad Coverage
Curved barriers block used slurry and spread fresh slurry across the polishing pad to improve CMP uniformity, cut defects, and reduce slurry use.
- CMP Pad Temperature Control Using Staged Purging and Slurry
Staged warm and cool purging compounds with matched slurry temperatures stabilize CMP heat, polishing rate, and wafer flatness.