Substrate Cleaning Load Feedback for Precise Wafer Contact
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Solution Overview
Problem
The miniaturization of semiconductor devices requires more precise control of the pressing load during substrate cleaning to prevent residue-induced leaks and adhesion defects, necessitating improved accuracy in substrate cleaning devices.
Innovation Solution
A substrate cleaning device with a cleaning member, rotation unit, drive unit, load measurement unit, and control unit that adjusts the pressing load by comparing measurement values with set thresholds, using closed-loop control to converge the difference value to a target range, and correcting correspondence relations between pressing loads and amounts for accurate control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional open-loop control is used for pressing load, then device complexity is reduced, but manufacturing precision deteriorates due to insufficient pressing load accuracy
Solution Approach 1:
The patent implements a closed-loop feedback control system where a load measurement unit continuously measures the actual pressing load of the cleaning member, and a control unit compares this measurement with a target pressing load value. Based on the difference, the control unit automatically adjusts the pressing amount to maintain accurate pressing load control, thereby resolving the contradiction between manufacturing precision and device complexity.
2Adaptability or versatility
If substrate thickness decreases or substrate material changes, then adaptability is improved, but manufacturing precision deteriorates due to reduced pressing load accuracy
Solution Approach 1:
The patent employs a dynamic pressing load control system that can adapt to different substrate conditions. The control unit adjusts the target pressing load value based on substrate thickness and material characteristics, and the feedback mechanism continuously monitors and corrects the actual pressing load. This dynamic adjustment capability maintains manufacturing precision across various substrate types and thicknesses, resolving the contradiction between adaptability and manufacturing precision.
Data Source
AI summary
A substrate cleaning device includes: a pressing member that cleans a substrate by contacting the substrate; a load measurement unit that measures a pressing load of the cleaning member; and a control unit that repeats an operation of comparing the measurement value of the load measurement unit with the setting load, changing the pressing amount of the cleaning member by a first movement amount so that a difference value decreases, when the difference value is larger than a first threshold value and equal to or smaller than a second threshold value, and changing the pressing amount of the cleaning member by a second movement amount larger than the first movement amount so that the difference value decreases, when the difference value is larger than the second threshold value, until the difference value becomes equal to or smaller than the first threshold value.