Substrate Cleaning Feedback Control for Precise Pressing Load
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Solution Overview
Problem
The miniaturization of semiconductor devices requires more precise control of the pressing load during substrate cleaning to prevent residue-induced leaks and adhesion defects, necessitating improved accuracy in substrate cleaning devices.
Innovation Solution
A substrate cleaning device with a cleaning member, rotation unit, drive unit, load measurement unit, and control unit that adjusts the pressing load by comparing measurement values with set thresholds, using closed-loop control to minimize differences and optimize processing speed and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional open-loop control is used for pressing load, then device complexity is reduced, but manufacturing precision deteriorates due to insufficient pressing load accuracy
Solution Approach 1:
The patent implements a closed-loop feedback control system where a load cell measures the actual pressing load and feeds this information back to a control device. The control device compares the measured load with the target load and adjusts the air cylinder output accordingly, ensuring accurate pressing load control while resolving the contradiction between precision and complexity.
2Manufacturing precision
If slower processing speed is used, then manufacturing precision is improved, but productivity deteriorates due to reduced substrates processed per unit time
Solution Approach 1:
The feedback control system enables real-time monitoring and adjustment of pressing load, allowing the system to maintain high cleaning precision while operating at optimal speeds. The dynamic adjustment capability eliminates the need for slow, conservative processing speeds, thereby improving productivity without sacrificing quality.
3Manufacturing precision
If pressing load is increased to improve cleaning effectiveness, then manufacturing precision is improved, but loss of energy increases due to higher actuator power consumption
Solution Approach 1:
The feedback control system dynamically adjusts the pressing load to the minimum necessary level to achieve the required cleaning quality. By continuously monitoring the actual load and comparing it with the target, the system avoids excessive energy consumption while maintaining effective cleaning, thus resolving the contradiction between cleaning quality and energy loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy of the pressing load, increases the number of substrates processed per unit time, and ensures high-precision cleaning, reducing defects and improving reliability.
Implementation Method 1
a load measurement unit that measures a pressing load of the cleaning member
Data Source
AI summary
A substrate cleaning device includes: a pressing member that cleans a substrate by contacting the substrate; a load measurement unit that measures a pressing load of the cleaning member; and a control unit that repeats an operation of comparing the measurement value of the load measurement unit with the setting load, changing the pressing amount of the cleaning member by a first movement amount so that a difference value decreases, when the difference value is larger than a first threshold value and equal to or smaller than a second threshold value, and changing the pressing amount of the cleaning member by a second movement amount larger than the first movement amount so that the difference value decreases, when the difference value is larger than the second threshold value, until the difference value becomes equal to or smaller than the first threshold value.