CMP Wafer Transfer Robot With Buffer-Assisted Flipping
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Solution Overview
Problem
Current CMP wafer cleaning equipment faces challenges in safe storage of wafers during equipment failures and inefficient wafer transfer processes, leading to potential contamination and reduced transfer efficiency due to limitations in vertical and horizontal cleaning configurations and the need for wafer flipping.
Innovation Solution
The introduction of a CMP wafer cleaning equipment with a buffer unit for safe storage and a wafer transfer robot equipped with independent flipping capabilities, featuring horizontal and vertical movement axes and grabbing devices to facilitate efficient conversion between cleaning and drying states, reducing the risk of contamination and optimizing space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the wafer transfer robot moves onto the top of drying equipment to flip wafers, then the wafer can be flipped from vertical to horizontal state, but the cleanliness of wafer surface is lowered due to impurity particles introduced during placement
Solution Approach 1:
A buffer unit is introduced as an intermediary component between the cleaning equipment and the wafer storage area. The buffer unit receives wafers from the cleaning equipment and can store them temporarily, preventing direct contact between the wafer transfer robot and the drying equipment during wafer flipping operations. This intermediary buffer zone isolates the wafer surface from impurity particles generated during the flipping process.
2Adaptability or versatility
If the wafer transfer robot has transverse travel running through the entire cleaning module, then the robot can access all cleaning units, but the transfer efficiency is reduced due to long travel distance
Solution Approach 1:
The cleaning module is segmented into multiple independent cleaning units (first cleaning unit, second cleaning unit, third cleaning unit) that can be accessed sequentially. The wafer transfer robot performs operations in a systematic sequence: first cleaning unit → buffer unit → second cleaning unit → buffer unit → third cleaning unit. This segmentation allows the robot to minimize unnecessary travel by returning to the buffer unit as an intermediate stopping point, rather than traversing the entire length of the cleaning module in each operation.
3Area of stationary object
If vertical cleaning unit is used to save equipment space, then equipment footprint is reduced, but the drying effect is inferior due to gravity influence during spin-drying
Solution Approach 1:
The system employs dynamic wafer orientation control where wafers are held in vertical state during cleaning operations and then flipped to horizontal state specifically for the spin-drying operation. The wafer transfer robot with flipping capability enables this dynamic reorientation, allowing the system to maintain a compact vertical configuration for cleaning while achieving optimal horizontal drying conditions when needed.
4Reliability
If buffer unit is added for safe storage of wafers, then fault tolerance is improved, but equipment complexity increases
Solution Approach 1:
The buffer unit is designed with multi-functionality to justify its addition to the system. It serves multiple purposes: (1) safe storage of wafers during equipment failures, (2) intermediate holding position during sequential cleaning operations, (3) isolation zone that prevents contamination during wafer flipping, and (4) buffer that decouples the timing between cleaning operations and wafer transfer. This multi-functionality reduces the need for separate dedicated components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances fault tolerance by ensuring safe storage of wafers, improves transfer efficiency, and maintains cleanliness by eliminating the need for additional space for flipping, allowing for flexible wafer placement modes and reducing the risk of impurity particle scattering during the drying process.
Implementation Method 1
due to the influence of gravity during spin-drying
Implementation Method 2
present more consistent megasonic cleaning and scrubbing process
Data Source
AI summary
Disclosed are a CMP wafer cleaning apparatus, and a wafer transfer manipulator and a wafer overturn method for same. The wafer transfer manipulator includes: a transverse transfer shaft, with same only being located at a side of a cleaning unit; a transverse transfer carriage provided on the transverse transfer shaft, and capable of transversely moving along the transverse transfer shaft; a first vertical lifting shaft provided on the transverse transfer carriage, and capable of vertically moving on the transverse transfer carriage; a rotary table provided on the first vertical lifting shaft; and a first claw clamping arm connected to the rotary table, and driven by the rotary table to move in a rotational manner. The CMP wafer cleaning apparatus is provided, and when the CMP wafer cleaning apparatus fails, safe storage of a polished wafer can be realized.