Coating Film-Forming Composition for Metal-Resin Adhesion
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Solution Overview
Problem
Existing methods for improving adhesion between metals and resins in printed wiring boards, such as surface roughening and coating film formation using silane coupling agents, often result in insufficient adhesion and require lengthy processing times or additional metal layers, limiting their application in thin wiring and microfabrication.
Innovation Solution
A coating film-forming composition containing an aromatic compound with an amino group and aromatic ring, a polybasic acid, and an oxidizing agent, applied within a specific pH and halide ion concentration range, which forms a stable coating film on metal surfaces to enhance adhesion to resins without the need for additional metal layers or prolonged processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If surface roughening is performed to improve adhesion, then adhesion between metal and resin is improved, but etching depth must be increased which causes remarkable thinning of the wiring
Solution Approach 1:
The patent introduces an organic compound coating film as an intermediary layer between the metal surface and the resin. This coating film, formed by applying a composition containing a specific organic compound (such as a silane coupling agent or titanate coupling agent), serves as a mediator that enhances adhesion without requiring deep etching of the metal wiring, thus resolving the contradiction between improving adhesion and preserving wiring thickness.
2Strength
If conventional coating film-forming compositions are used, then adhesion to resin can be improved, but film adhesion on metal surface is poor and processing time must be increased
Solution Approach 1:
The patent modifies the chemical parameters of the coating film-forming composition by specifying particular organic compounds with defined molecular structures and functional groups. The composition contains an organic compound with specific characteristics (such as silane or titanate coupling agents) that enable rapid and strong adhesion to metal surfaces. By optimizing these chemical parameters, the patent achieves both improved adhesion strength and reduced processing time, as the enhanced reactivity and binding affinity of the specified compounds allow for faster film formation and bonding.
3Strength
If additional metal layers are added to improve adhesion, then adhesion between metal and resin is improved, but device complexity increases
Solution Approach 1:
The patent replaces the conventional approach of adding additional metal layers (such as tin plating) with an organic compound coating film as an intermediary layer. This organic coating, formed by applying a composition containing specific organic compounds (silane coupling agents, titanate coupling agents, or other adhesion-promoting organic compounds), serves as a non-metallic mediator that enhances adhesion between the metal and resin without increasing structural complexity or requiring additional metal deposition processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent adhesion between metals and resins, allowing for the formation of a metal-resin composite with improved bonding strength and reduced processing time, suitable for thin wiring and microfabrication applications.
Implementation Method 1
contains an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxyl groups, and an oxidizing agent
Implementation Method 2
a coating film-forming composition containing an aromatic compound with an amino group and aromatic ring, a polybasic acid, and an oxidizing agent, applied within a specific pH and halide ion concentration range, which forms a stable coating film on metal surfaces
Data Source
Figure 1~2
AI summary
The coating film-forming composition is a solution of pH 4 to 10 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and an oxidizing agent. As the oxidizing agent, hypochlorous acid, chlorous acid, chloric acid, perchloric acid, persulfuric acid, percarbonic acid, hydrogen peroxide, organic peroxides, or the like is used. The aromatic compound preferably contains a nitrogen-containing aromatic ring, and more preferably contains a primary amino group or a secondary amino group. The coating film-forming composition is used for, for example, forming a coating film on surface of a metal member.