Coating Film Composition for Semiconductor Foreign Matter Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor device production, foreign matters such as bonding agent residues often remain on substrates after temporary bonding, and existing methods fail to completely remove these residues, leading to defective products and reduced yield.
Innovation Solution
A composition forming a coating film using a polymer and solvent, specifically phenolic hydroxy group-containing or carboxy group-containing polymers, which is applied, baked, and then removed with a developer, allowing for the simultaneous removal of foreign matters and the coating film, even after exposure to heat and chemicals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bonding layer is formed directly on the surface of a semiconductor substrate having wiring and others, then bonding strength is improved, but foreign matters (bonding agent residues) remain on the substrate after peeling
Solution Approach 1:
The invention divides the bonding process into two separate layers: a first bonding layer in contact with the substrate and a second bonding layer above it. The second bonding layer serves as a sacrificial layer that can be easily peeled off along with foreign matters, while the first bonding layer maintains strong adhesion to the substrate. This segmentation resolves the contradiction by separating the bonding function from the foreign matter adhesion function.
Solution Approach 2:
The second bonding layer acts as an intermediary between the first bonding layer and the foreign matters. It provides a interface that allows foreign matters to be trapped and removed together with the bonding layer, while not compromising the bonding strength of the first layer. This intermediary layer mediates between the need for strong bonding and complete foreign matter removal.
2Ease of manufacture
If cleaning is conducted using known organic solvent or liquid chemical agent, then some foreign matters are removed, but foreign matters cannot be completely removed
Solution Approach 1:
The invention performs preliminary action by forming a specific bonding layer structure before the cleaning process. The second bonding layer is designed to trap foreign matters during peeling, preparing them for easy removal in subsequent cleaning steps. This preliminary structuring enables complete foreign matter removal using simple cleaning processes, resolving the contradiction between cleaning simplicity and removal completeness.
3Productivity
If a coating film is used to remove foreign matters, then foreign matter removal efficiency is improved, but the coating film itself becomes an additional substance to be removed
Solution Approach 1:
The invention merges the foreign matter removal function with the bonding layer itself. Instead of using a separate coating film that needs to be applied and then removed, the bonding layer is designed to serve dual purposes: providing bonding strength and enabling foreign matter removal. The second bonding layer is specifically formulated to be easily removable along with foreign matters, combining multiple functions into one component and reducing overall process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively and easily removes foreign matters from substrates, reducing defective products and improving semiconductor device yield by ensuring complete removal of residues without damaging the substrate.
Implementation Method 1
the polymer is selected from a phenolic hydroxy group-containing polymer and a carboxy group-containing polymer, and the composition contains the polymer in an amount of 50% by mass or more relative to the total solid content in the composition
Data Source
AI summary
A simple method for removing foreign substances that are formed on a substrate during a semiconductor device production process and a composition for forming a coating film for foreign substance removal, said coating film being used in the above-described method. A composition for forming a coating film for foreign substance removal, said composition containing a polymer and a solvent and being capable of forming a coating film that dissolves in a developer liquid, wherein: the polymer is selected from among phenolic novolacs, polyhydroxystyrene derivatives and carboxylic acid-containing polymers; and the polymer is contained in an amount of 50% by mass or more relative to the total solid content in the composition.