Coating Film Protects Conductive Films During Developer Contact
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Solution Overview
Problem
In the manufacturing of liquid crystal display devices, the photosensitive film is often removed more than necessary, and conductive films are damaged due to cell reactions with developers or etchants, leading to issues with the size and resistance of reflective electrodes and gate terminals.
Innovation Solution
A method is introduced where a coating film is formed on the substrate before the photosensitive film, preventing the conductive portions from contacting the developer and reducing cell reactions, and a sacrificial electrode is used to distribute the cell reaction area, minimizing damage and excessive removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the photosensitive film is exposed to light and then developed, then the pattern is formed, but the conductive films covered with the photosensitive film appear and the developer contacts them causing excessive removal and damage
Solution Approach 1:
A coating film is introduced as an intermediary layer between the conductive films and the developer. This coating film prevents direct contact between the developer and conductive films during the development process, thereby eliminating the harmful cell reactions that cause excessive photosensitive film removal and conductive film damage, while still allowing the pattern formation to proceed accurately.
Solution Approach 2:
The coating film is formed on the conductive films before the photosensitive film is applied and processed. This preliminary protective action ensures that when the photosensitive film is later developed, the conductive films are already protected from developer contact, preventing the harmful effects before they can occur.
2Productivity
If the developer contacts the various conductive films, then the development process completes, but the photosensitive film is removed more than necessary
Solution Approach 1:
The coating film serves as a protective intermediary that allows the development process to complete normally while preventing the developer from contacting the conductive films. This eliminates the cell reactions that cause excessive photosensitive film removal, ensuring that only the intended pattern areas are removed with minimal loss.
3Productivity
If the conductive film makes contact with the developer, then the development proceeds, but the conductive film is damaged
Solution Approach 1:
The coating film acts as a protective intermediary layer that permits the development process to proceed to completion while preventing direct contact between the developer and conductive films. This maintains conductive film integrity and reliability without impeding the development process.
Solution Approach 2:
The coating film is applied to the conductive films in advance, before the photosensitive film processing begins. This preliminary protective measure ensures that when development occurs, the conductive films are already shielded, maintaining their integrity throughout the process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents unnecessary removal of the photosensitive film and damage to conductive films, ensuring accurate formation of reflective electrodes and gate terminals with improved size and resistance.
Implementation Method 1
the conductive portions covered with the coating film do not contact the developer. As a result of this, the conductive portions covered with the coating film do not act as an anode or a cathode, and thus a cell reaction will not occur
Implementation Method 2
exposing the photosensitive film to light and then developing it
Data Source
AI summary
A method for manufacturing an electronic device comprises a step for forming a coating film (100) on a surface of a conductor portion-containing body (500), a step for forming a photosensitive film (110) on the conductor (500) on which the coating film (100) has been formed, a step for exposing the photosensitive film (110) to a pattern corresponding to a patterned recessed or protruded portion, a step for developing the exposed photosensitive film (110), and a step for baking the developed photosensitive film (110). With this method, an excessive removal of a metal film can be prevented or suppressed.


