Power Electronics Module with Coaxial Gate-Emitter Circuit
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Solution Overview
Problem
Power electronics modules face challenges in achieving high power density and minimizing stray inductance due to the arrangement of semiconductor chips and electrical conductors, which also complicates manufacturing processes.
Innovation Solution
A power electronics module design featuring a substrate with metallization layers, semiconductor switch chips with vertical power electrodes, and a conductor plate that covers the semiconductor switch chip except for the gate electrode, along with a gate conductor that extends through an opening in the conductor plate, minimizes the footprint and stray inductance by creating a coaxial gate-emitter circuit arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If die stacking is used to increase power density, then the footprint of semiconductor chips is reduced, but stray inductance increases due to complex electrical interconnections and electromagnetic coupling
Solution Approach 1:
The conductor plate merges the emitter connection function with the gate shielding function into a single integrated component. The gate conductor is bonded directly to the conductor plate, creating a unified structure that reduces the number of separate electrical interconnections and minimizes stray inductance while maintaining high power density through die stacking
Solution Approach 2:
The gate conductor is nested within the structure formed by the conductor plate and substrate metallization layer. This nested arrangement creates a compact, coaxial gate-emitter circuit path that minimizes the loop area and reduces electromagnetic coupling, allowing the gate signal to be transmitted through the center of the power circuit without adding external inductance
2Volume of moving object
If die stacking is implemented, then power density increases, but manufacturing complexity increases due to multiple bond layer interfaces
Solution Approach 1:
The conductor plate serves multiple functions simultaneously: it provides the emitter electrical connection, acts as a shielding layer for the gate conductor, and serves as a structural support element. This multi-functionality reduces the number of separate components and bonding interfaces required, simplifying the manufacturing sequence while maintaining high power density
Solution Approach 2:
The electrical interconnection structure is segmented into distinct functional zones: the substrate metallization layer for power connection, the conductor plate for emitter connection and shielding, and the gate conductor for control signals. This segmentation allows each component to be optimized independently and bonded in a standardized sequence, reducing manufacturing complexity
3Ease of manufacture
If traditional two-dimensional circuit layout is used, then manufacturing is simpler, but power density is reduced due to larger footprint
Solution Approach 1:
The circuit layout transitions from a two-dimensional side-by-side arrangement to a three-dimensional stacked configuration. The gate conductor passes vertically through the conductor plate via a via, creating a coaxial arrangement that minimizes the horizontal footprint while maintaining manufacturing simplicity through standardized bonding processes and clear spatial separation of functions
Data Source
AI summary
A power electronics module includes a substrate with a substrate metallization layer, which is separated into conducting areas for providing conducting paths for the power electronics module; a semiconductor switch chip bonded with a first power electrode to a first conducting area of the substrate metallization layer; a conductor plate bonded to a second power electrode of the semiconductor switch chip opposite to the first power electrode.