Coaxial Through-Insulator Via Shielding for Low-Noise Packages
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Solution Overview
Problem
Modern semiconductor devices face issues with electrical noise and electromagnetic interference due to the integration and miniaturization of components, particularly from RF devices, which affect signal quality and compatibility in semiconductor packaging.
Innovation Solution
The implementation of a co-axial Through Insulator Via (TIV) structure that includes an inner conductive core and an outer conductive shielding layer, surrounded by an insulating layer, to reduce electromagnetic interference and noise, while maintaining efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packaging is used with integrated RF devices, then device integration and miniaturization are achieved, but electrical noise and electromagnetic interference increase
Solution Approach 1:
The patent implements a nested coaxial structure where an inner conductive core is surrounded by an insulating layer, which is in turn surrounded by an outer conductive shielding layer. This nested configuration allows the shielding function to be integrated within the existing package footprint without increasing overall package size, while effectively containing electromagnetic interference generated by RF devices.
Solution Approach 2:
The insulating layer positioned between the inner conductive core and outer conductive shielding layer serves as an intermediary that electrically isolates the two conductive elements while maintaining their coaxial relationship. This intermediary layer prevents direct electrical contact that would short-circuit the shielding function while allowing the structure to maintain mechanical integrity.
2Object-generated harmful factors
If shielding structures are added to reduce electromagnetic interference, then noise reduction is achieved, but device complexity increases
Solution Approach 1:
The coaxial TIV structure serves multiple functions simultaneously: it provides electrical signal transmission through the inner conductive core, electromagnetic shielding through the outer conductive layer, and electrical isolation through the insulating layer. This multi-functionality consolidates what would otherwise require separate components into a single integrated structure, reducing overall package complexity while achieving noise reduction.
Solution Approach 2:
The patent merges the signal transmission function and electromagnetic shielding function into a single coaxial TIV structure. Instead of using separate signal vias and shielding structures, the coaxial configuration combines these functions, reducing the number of discrete components and simplifying the overall package design.
3Reliability
If multiple isolation lines and vias are used to manage noise, then signal isolation is improved, but interconnect lengths increase
Solution Approach 1:
The nested coaxial configuration allows the shielding function to be achieved within the same spatial envelope as the signal transmission path, eliminating the need for additional isolation lines and extending interconnects. The outer conductive shielding layer surrounds the inner signal-carrying core, providing isolation without requiring separate isolation structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure reduces electromagnetic interference, minimizes the number of isolation lines and vias, and shortens interconnect lengths, enhancing the suitability of integrated circuit packages for advanced portable products while reducing manufacturing costs and improving efficiency.
Implementation Method 1
an outer conductive shielding layer surrounds the inner conductive core and the insulating layer... The outer conductive shielding layer includes copper and/or copper alloy, and is electrically grounded
Data Source
AI summary
A package structure includes a first redistribution structure, an insulating material over the first redistribution structure, a die embedded in the insulating material, a second redistribution structure over the die and the insulating material, and a first via extending through the insulating material, wherein the first via includes a first inner conductive core, and a first outer conductive shielding layer, wherein the insulating material is disposed between the first inner conductive core and the first outer conductive shielding layer, and wherein the first outer conductive shielding layer has an annular shape in a top-down view.