COB LED Module with Thin-Film Rectifier for AC Operation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing LED modules operating with AC voltage require additional components like rectifiers and fuses, which cannot be realized in COB technology, leading to increased manufacturing costs and space consumption, as well as potential issues with leakage current and voltage fluctuations.
Innovation Solution
An LED module is designed using COB technology with a base substrate having an insulating layer, where at least one LED die is mounted directly on the insulating layer, and additional semiconductor dies with electronic components are arranged at a spatial distance to provide necessary functionality, including rectification and protection, while maintaining insulation and heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional components like rectifiers and fuses are placed as separate modules next to the COB chip, then AC voltage operation is enabled, but space consumption increases and manufacturing cost increases
Solution Approach 1:
The patent merges the rectifier circuit and fuse with the LED chip assembly by fabricating them on the same substrate using thin-film deposition techniques. The rectifier circuit is formed by depositing conductive layers and insulating layers to create diodes and circuit traces, while the fuse is created as a thin-film resistive element. This integration eliminates the need for separate discrete modules, reducing overall space consumption while maintaining AC voltage operation capability.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it acts as the mounting platform for the LED chip, the circuit board for the rectifier circuit, and the structural base for the entire module. The thin-film layers provide both electrical functionality (rectification, protection) and mechanical support, creating a multi-functional integrated structure that reduces the number of separate components needed.
2Adaptability or versatility
If additional components like rectifiers and fuses are placed as separate modules next to the COB chip, then AC voltage operation is enabled, but manufacturing cost increases
Solution Approach 1:
The patent combines the fabrication of the rectifier circuit, fuse, and LED chip assembly into a single manufacturing process using thin-film deposition on a common substrate. This integrated approach allows all components to be produced simultaneously in a factory setting, eliminating the need for separate procurement, inventory management, and assembly steps, thereby reducing overall manufacturing cost despite the added technical capability.
Solution Approach 2:
The patent changes the manufacturing parameters from discrete component assembly to thin-film deposition processes. By controlling deposition thickness, material composition, and pattern formation during fabrication, the rectifier circuit and fuse are created as integral parts of the substrate structure, enabling cost-effective mass production through standardized thin-film manufacturing techniques.
3Reliability
If protective distances and insulation are maintained to prevent leakage current and voltage crosstalk, then safety is ensured, but space consumption increases
Solution Approach 1:
The patent uses thin-film insulating layers deposited on the substrate to provide electrical isolation and prevent leakage current. These thin-film insulation structures provide the necessary protective distances and electrical separation between the rectifier circuit, fuse, and LED chip, ensuring safety against leakage current and voltage crosstalk while occupying minimal space due to their thin-film nature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for the production of an LED module that can operate with AC voltage efficiently, reducing manufacturing costs and ensuring reliable operation by integrating necessary electronic components within the COB structure, while maintaining insulation and heat management.
Implementation Method 1
a base substrate (1), on which an insulating layer (2) is applied over the entire surface
Implementation Method 2
at least one LED die (3), which is embodied as an unpackaged semiconductor chip and placed on the insulation layer (2)
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The invention relates to an LED module in chip-on-board technology, comprising: a base substrate; an insulating layer formed over the entire surface of the base substrate; at least one LED die mounted directly on the insulating layer; a substrate formed on the insulating layer at a spatial distance from the at least one LED die; and at least one further semiconductor die comprising at least one further electronic component configured to connect the LED die. A method for manufacturing an LED module is also provided.