COB LED Electrode Retention via Grooved Substrate and Sealing Ring
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Solution Overview
Problem
Conventional chip-on-board light-emitting diodes (COB LEDs) face a yield reduction issue due to the easy peeling of the copper layer from the metal substrate, caused by insulation layer deterioration during manufacturing.
Innovation Solution
An illuminating device design featuring a substrate with a groove and retaining slots for electrode elements, combined with a sealing ring embedded in the groove, securely retains the electrode elements, preventing separation from the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a copper layer is attached on the metal substrate via an insulation layer in conventional COB LEDs, then the electrode element can be electrically connected to the light-emitting diode chip, but the insulation layer is easily deteriorated during manufacturing, causing the copper layer to peel from the metal substrate and reducing yield rate
Solution Approach 1:
The patent removes the insulation layer from the structure, extracting the problematic component that caused peeling. The copper layer is directly attached to the metal substrate without an insulation layer, eliminating the deterioration issue while maintaining electrical connection functionality through direct contact between the copper electrode and substrate.
Solution Approach 2:
The patent performs preliminary action by directly forming the copper layer on the metal substrate before any other manufacturing steps. This direct attachment approach prevents subsequent peeling issues that would occur with insulation layers during the manufacturing process, ensuring stable electrode-element attachment throughout production.
2Reliability
If an insulation layer is used to attach the copper layer on the metal substrate, then electrical connection can be established, but the insulation layer deteriorates easily during manufacturing, causing peeling and decreasing yield rate
Solution Approach 1:
The patent extracts and removes the insulation layer from the structure, eliminating the source of manufacturing defects. By directly attaching the copper layer to the metal substrate without an intermediate insulation layer, the patent prevents peeling issues and improves yield rate while maintaining reliable electrical connections.
Solution Approach 2:
The patent uses a composite structure where the copper layer is directly integrated with the metal substrate, forming a stable metallurgical or mechanical bond. This composite approach eliminates the need for separate insulation layers and creates a more reliable, peel-resistant attachment that improves manufacturing yield.
Data Source
AI summary
An illuminating device including a substrate, a light-emitting diode element disposed on the substrate, an electrode element, and a sealing ring. The substrate has a groove, and the electrode element has a retaining slot disposed in the groove. The sealing ring is embedded into the retaining slot and a part of the groove to tightly fix the electrode element on the groove.