COB LED Submount with Segmented Retention Walls
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Solution Overview
Problem
Conventional lighting technologies, such as incandescent, fluorescent, and metal halide HID lighting, fail to provide satisfactory performance in terms of customizable light intensity, patterns, and colors due to inherent design limitations.
Innovation Solution
The development of surface mountable chip-on-board (COB) LEDs with improved light output characteristics, featuring a submount with conductive traces, wirebonds, retention materials to separate light emitting zones, and encapsulant materials to optimize light emission and output, allowing for varied lighting patterns and colors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional lighting technologies (incandescent, fluorescent, metal halide HID) are used, then basic lighting function is provided, but customizable light intensity, patterns, and colors cannot be achieved
Solution Approach 1:
The patent segments the lighting system into multiple individually addressable LED elements arranged in strings or matrices on a submount. Each LED can be controlled independently through separate electrical contacts and control circuits, enabling customizable light intensity, patterns, and colors while maintaining reliable solid-state lighting performance
Solution Approach 2:
The patent implements dynamic control capabilities by providing individually addressable LED elements that can vary their emission characteristics in real-time. Control circuits enable adjustment of light intensity, color, and temporal patterns, transforming static lighting into a dynamically adaptable system
2Productivity
If surface mountable COB LEDs are used to improve light output characteristics, then light emission efficiency and beam angle are improved, but device structure becomes more complex
Solution Approach 1:
The patent merges multiple LED elements, electrical contacts, control circuits, and optical components into an integrated COB (Chip on Board) assembly. The submount serves as a common platform that mechanically and electrically integrates all components, achieving improved light emission efficiency while managing structural complexity through consolidation
Solution Approach 2:
The submount structure serves multiple functions simultaneously: mechanical support for LED elements, electrical connection through conductive traces and contacts, thermal management, and optical element mounting. This multi-functionality reduces the need for separate components and simplifies the overall device structure
3Adaptability or versatility
If individually addressable LED strings are implemented to provide varied lighting patterns, then lighting versatility is improved, but manufacturing complexity increases
Solution Approach 1:
The patent implements preliminary organization of LED elements into pre-configured strings or matrices during manufacturing. Electrical contacts and control circuitry are pre-arranged on the submount to enable individual addressing, and LEDs are pre-soldered in designated positions. This preliminary structuring simplifies assembly and enables lighting pattern versatility without excessive manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced light emission profiles, improved efficiency, and cost-effectiveness, making it suitable for various lighting applications with improved luminal output and reduced beam angle.
Implementation Method 1
Light emitting diodes (LEDs) are solid state devices that convert electrical energy into light
Implementation Method 2
A reflective material (also referred to as a white wall)
Data Source
AI summary
A light emitter device includes a submount with a top surface and a bottom surface, electrically conductive traces on the top surface of the submount, light emitting diodes (LEDs) arranged on the top surface of the submount in light emitter zones, with the LEDs being electrically connected to respective traces of the traces, a retention material disposed over the top surface of the submount in a form of walls which physically separate the light emitter zones, and encapsulants that are dispensed in respective light emitter zones of the light emitter zones. A least a portion of the plurality of walls of the retention material can comprise a translucent material, a reflective material, and/or a light-absorbing material. The LEDs are individually addressable to independently control an output of light from each of the LEDs to produce a specified light output.