Co-extruded Microchannel Heat Pipe for IC Thermal Management
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Solution Overview
Problem
Conventional methods for manufacturing microchannel heat pipes are costly and inefficient, making them unsuitable for widespread incorporation into commercial devices like integrated circuits, where effective thermal management is crucial due to increasing heat flux with smaller feature sizes and higher transistor densities.
Innovation Solution
A cost-effective method using a co-extrusion process to form microchannel heat pipes with a pipe body composed of a single extruded material, featuring elongated side and upper wall portions that define a central channel, which can be integrated directly into ICs or attached post-fabrication, using materials like silver, copper, or polymers, and encapsulating a working fluid within the channel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods (etching, machining, sintering) are used to manufacture microchannel heat pipes, then the heat pipe structure can be formed with required precision, but the manufacturing cost increases significantly and production efficiency decreases
Solution Approach 1:
The patent changes the manufacturing parameters from conventional high-precision methods (etching, machining, sintering) to a molding process that achieves required precision through optimized mold design and material selection, thereby reducing manufacturing cost while maintaining channel geometry accuracy
Solution Approach 2:
The patent employs a disposable master mold that can be easily fabricated and replaced, eliminating the need for expensive precision tooling. The master mold is used to create reusable injection molds, transferring the precision requirement from the mold-making process to the injection molding process, which is inherently more cost-effective for high-volume production
2Strength
If conventional methods are used to manufacture microchannel heat pipes, then the required structural integrity is achieved, but the production time and complexity increase
Solution Approach 1:
The patent combines multiple manufacturing steps (channel formation, sealing structure creation, and heat pipe assembly) into a single injection molding operation, producing the complete microchannel heat pipe in one step. This eliminates sequential processing steps and significantly improves production efficiency while maintaining structural integrity through integrated design
Solution Approach 2:
The patent incorporates sealing structures and channel geometries directly into the mold cavity before injection, so that these features are formed automatically during the molding process rather than requiring subsequent assembly or processing steps, thereby accelerating production
3Temperature
If microchannel heat pipes are integrated into ICs, then thermal management effectiveness improves, but the integration cost and fabrication complexity increase
Solution Approach 1:
The patent designs the microchannel heat pipe with a standardized base that can be directly attached to various IC packages, making the thermal management solution universally applicable across different device types. This standardized interface simplifies integration while maintaining effective heat transfer performance
Solution Approach 2:
The patent introduces a simplified intermediate attachment structure that mediates between the IC package and the microchannel heat pipe, eliminating the need for complex direct integration. This intermediary base plate allows for straightforward mechanical attachment and thermal coupling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient and inexpensive integration of microchannel heat pipes into ICs, enhancing thermal management by maintaining high thermal conductivity while being compatible with conventional IC fabrication techniques, thus addressing the cost and integration challenges of existing methods.
Implementation Method 1
a pipe body formed entirely by extruded material that is deposited on the surface of a substrate using an inexpensive co-extrusion process
Implementation Method 2
heat generated in the high temperature region of the host device is absorbed at the high temperature end of the microchannel heat pipe, causing liquid working fluid to boil
Implementation Method 3
causing liquid working fluid to boil. The relatively high pressure thus generated at the high temperature end forces the resulting vaporized working fluid
Implementation Method 4
where the vapor condenses again to liquid working fluid, thus releasing heat
Implementation Method 5
The resulting difference between the curvature of the liquid-vapor interface at the hot and cold ends of the microchannel heat pipe results in a capillary force by which the liquid working fluid flows from the low temperature end back to the high temperature end
Implementation Method 6
deposited on the surface of a substrate using an inexpensive co-extrusion process, and then cured or otherwise hardened to provide a pipe structure
Data Source
AI summary
A microchannel heat pipe formed on a substrate surface using co-extruding a primary material and a secondary material such that the primary material forms side wall portions that are spaced apart by the secondary material, and an upper wall portion is formed across the upper ends of the side walls to form a composite structure. After the primary material hardens, the secondary material is removed, whereby the hardened primary material forms a pipe body having an elongated central channel defined between opposing end openings. A working fluid is then inserted into the elongated central channel, and sealing structures are then formed over both end openings to encapsulate the working fluid.