COF Ground Pad Placement for Narrow Display Frames
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Solution Overview
Problem
As display technology advances, higher resolution displays require more wires in the frame area, leading to increased size of the lower frame area due to the need for ground pads, which is not favorable for narrowing the frame of the display panel.
Innovation Solution
The placement of a Chip On Flex (COF) with a ground pad on the second surface, away from the first substrate, allows for static electricity discharge without occupying the step area, reducing the frame size by eliminating the need for additional wires in the step area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ground pads are disposed on the array substrate in the lower frame area, then static electricity can be discharged, but the lower frame area is enlarged which is not favorable for narrowing the frame of the display panel
Solution Approach 1:
The patent moves the ground pad from the array substrate plane to the COF substrate plane, utilizing the third dimension (vertical stacking) to relocate components. The COF substrate is disposed below the array substrate, and ground pads are formed on the COF substrate, thereby discharging static electricity without occupying additional area in the lower frame area of the display panel.
Solution Approach 2:
The patent integrates the ground pad function into the COF substrate structure, nesting the grounding function within the existing COF component. The COF substrate serves dual purposes: driving the display and providing static electricity discharge pathways, eliminating the need for separate ground pad structures on the array substrate.
2Productivity
If more wires are disposed in the frame area to support higher resolution, then data transmission capability is improved, but the frame area is enlarged which is not favorable for narrowing the frame
Solution Approach 1:
The patent relocates wiring and grounding functions to the COF substrate plane, utilizing vertical stacking to move components out of the lateral frame area. This dimensional transition allows high-resolution data transmission without proportionally increasing the horizontal frame area.
Solution Approach 2:
The patent combines multiple functions (data transmission, grounding, and driving) into integrated structures on the COF substrate. By merging the ground pad function with the COF substrate and using shared wiring pathways, the design achieves high-resolution capability without linearly increasing frame area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the area occupied by the step area, narrows the frame of the display panel, and improves the utilization of the flexible substrate, while maintaining low maintenance costs and reducing defective risks.
Implementation Method 1
a conductive adhesive electrically connected to the conductive layer and the at least one ground pad
Data Source
AI summary
A display panel and a display device are provided. The display panel comprises a first substrate having a step area; a second substrate disposed opposite to the first substrate, wherein the second substrate has a first surface facing the first substrate and an opposite second surface; a Chip On Flex (COF) disposed on the step area of the first substrate and comprising at least one ground pad, wherein the COF has a first surface facing the first substrate and an opposite second surface, and the at least one ground pad is disposed on the second surface of the COF; a conductive layer disposed on the second surface of the second substrate; and a conductive adhesive electrically connected to the conductive layer and the at least one ground pad.