COF Semiconductor Package Heating Pad Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The high production costs and lower productivity of Tape Carrier Packages (TCP) for driving Liquid Crystal Display (LCD) panels necessitate the development of more efficient semiconductor packages, such as Chip On Flexible Printed Circuit (COF) packages, which require effective heat dissipation solutions to manage increased driving frequencies.
Innovation Solution
The COF type semiconductor package incorporates a flexible film with a semiconductor IC chip and a heating pad, where the heating pad may include slots or chamfered/rounded corners to reduce stress during handling and attachment, and reinforcement members to enhance adhesion and heat dissipation, ensuring the package can efficiently manage heat and maintain attachment under stress conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If TCP type semiconductor package is used to drive LCD panels, then high resolution display is achieved, but production cost increases and productivity decreases
Solution Approach 1:
The patent transitions from TCP to COF package type, changing the fundamental packaging parameter to achieve both high resolution display capability and improved productivity through more efficient manufacturing processes
2Measurement precision
If IC driver operating frequency is increased from 60 Hz to 120 Hz to achieve higher resolution display, then display performance improves, but heat generation increases
Solution Approach 1:
The heating pad that would normally be considered a harmful heat-generating component is repurposed as a beneficial heat-dissipating component by positioning it on the opposite side of the IC chip to conduct excess heat away from the device
Solution Approach 2:
The heating pad acts as an intermediary thermal management component between the IC chip and the flexible substrate, facilitating heat transfer from the chip to the substrate for dissipation
3Temperature
If heating pad is added to COF package for heat dissipation, then thermal management improves, but device complexity increases
Solution Approach 1:
The heating pad serves multiple functions simultaneously: it provides thermal management by dissipating heat from the IC chip, acts as a structural support element on the flexible substrate, and can be integrated into the existing COF package manufacturing process without requiring entirely new fabrication steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The COF package effectively regulates and dissipates excess heat, reducing stress on the heating pad and maintaining attachment, thereby improving productivity and reducing production costs while supporting higher resolution display devices with increased driving frequencies.
Implementation Method 1
a heating pad on the flexible film... a COF type semiconductor package may regulate or dissipate excess heat
Data Source
AI summary
A Chip on Flexible Printed Circuit (COF) type semiconductor package may include a flexible film, a semiconductor IC chip on the flexible film, and a heating pad on the flexible film.