COF Chip Packaging Structure for Precise 3D Display Bonding
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Solution Overview
Problem
Current manufacturing processes for 3D-display products using Chip On Film (COF) technology face limitations in bonding precision and the number of driving channels due to unequal coefficients of thermal expansion between the chip packaging component and the display panel, leading to difficulties in meeting the requirements of high-resolution 3D-display products.
Innovation Solution
A method for manufacturing a display device involving a chip packaging component with a flexible base, a rigid base, and a lead layer, where the orthographic projections of the leads on the flexible base are within the rigid base's projection, and the coefficients of thermal expansion of both bases are equal, allowing for high-precision bonding by reducing thermal expansion compensation, and optionally removing the rigid base to facilitate bending and reduce product size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional COF manufacturing process is used, then the manufacturing process is simple, but the bonding precision is limited due to thermal expansion differences
Solution Approach 1:
The chip packaging component is divided into two separate bases: a flexible base and a rigid base. The flexible base contains the lead layer, while the rigid base is disposed on the flexible base. This segmentation allows each base to have optimized properties for its specific function, enabling high-precision bonding while maintaining manufacturing feasibility.
Solution Approach 2:
The chip packaging component uses a composite structure combining flexible and rigid materials. The flexible base provides flexibility and bendability, while the rigid base provides dimensional stability and precise positioning. This composite structure resolves the contradiction by achieving both precision and manufacturability through material combination.
2Manufacturing precision
If the rigid base is kept in the chip packaging component, then the alignment precision is improved, but the product size and bending capability are limited
Solution Approach 1:
The rigid base performs its alignment and positioning function during the bonding process, and then its function is completed. The subsequent removal of the rigid base eliminates its volume contribution to the final product while preserving the alignment precision it provided during manufacturing. This preliminary action allows the rigid base to serve its purpose temporarily and then be discarded.
Solution Approach 2:
The rigid base is used during the bonding process to ensure precise alignment, and then it is removed in a separate step. This discarding of the rigid base after use reduces the final product size and enables better bending capability, while the alignment precision it provided during bonding is retained in the bonded structure.
3Manufacturing precision
If the coefficient of thermal expansion difference between bases is large, then the manufacturing process is simpler, but the bonding precision deteriorates due to thermal expansion compensation requirements
Solution Approach 1:
The patent changes the thermal expansion parameter by making the coefficients of thermal expansion of the flexible base and rigid base equal. This parameter change eliminates thermal expansion differences between the two bases, thereby improving bonding precision without requiring complex thermal expansion compensation processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances bonding precision and increases the number of output channels, effectively addressing the limitations of existing COF technologies and meeting the demands of high-resolution 3D-display products by ensuring precise alignment and reduced thermal expansion deviations.
Implementation Method 1
a coefficient of thermal expansion of the rigid base and a coefficient of thermal expansion of the rigid substrate are equal
Data Source
AI summary
A display device and a manufacturing method therefor are provided by the present application. The display devices can greatly increase the bonding precision of the chip packaging unit and the display panel, thereby the quantity of the output channels of chip packaging unit are greatly increased, thus the requirements of the high-resolution display products are satisfied. A chip packaging component is formed, wherein the chip packaging component includes at least one chip packaging unit; and the chip packaging unit includes at least a flexible base, a rigid base disposed at one side of the flexible base, and a lead layer disposed at one side of the flexible base away from the rigid base, lead layer includes at least a plurality of first leads, and orthographic projections of the plurality of first leads on the flexible base are located within an orthographic projection of rigid base on the flexible base.