Chip-on-film Package Vertical Wire Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current chip-on-film (COF) package technologies face challenges in achieving a high-density, flexible, and reliable connection structure that allows for efficient signal transmission and heat dissipation while preventing electromagnetic interference and spring back phenomena during device assembly.
Innovation Solution
A 2-layer COF package with a vertical structure using through-hole wires, where film-through wires connect first and second film wires on opposite surfaces of a flexible film substrate, and panel-through wires connect corresponding panel wires, enabling efficient signal transmission and heat dissipation while preventing bending and electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a flexible film substrate is used for COF package, then the device can be made thinner and more flexible, but spring back phenomena occur during assembly
Solution Approach 1:
The patent employs a flexible film substrate made of polyimide or polyester material to achieve thin and flexible device design. The flexible substrate enables the COF package to be bent and conform to various shapes while maintaining structural integrity and electrical connectivity throughout the flexible medium.
2Speed
If through-hole wires are used to connect layers, then signal transmission efficiency improves, but electromagnetic interference increases
Solution Approach 1:
The patent introduces a ground wire as an intermediary element positioned between signal transmission lines. This ground wire acts as a shield that redirects electromagnetic interference to ground potential, thereby protecting sensitive signal lines from noise while maintaining efficient signal transmission through the vertical wire structure.
3Productivity
If wire density is increased for high-density connection, then integration increases, but heat dissipation becomes more difficult
Solution Approach 1:
The patent segments the wire structure into multiple functional types: signal transmission wires, ground wires, and heat dissipation wires. This segmentation allows the heat dissipation wires to be specifically optimized for thermal management, with larger cross-sectional areas and direct thermal pathways to heat sinks, while maintaining high integration density through the coordinated arrangement of all wire types.
4Volume of moving object
If vertical wire structure is implemented, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent transitions from traditional planar wire routing to a vertical three-dimensional wire structure. Wires extend through the thickness of the flexible substrate, connecting different functional layers vertically rather than routing signals around obstacles in the plane. This dimensional change reduces the horizontal footprint and enables higher integration density.
Data Source
AI summary
Provided are a chip-on-film (COF) package and a device assembly including the same. The device assembly includes a COF package including a film substrate on which a plurality of film-through wires are formed. The device assembly includes a panel unit including a panel substrate on which a plurality of panel-through wires are formed. The panel unit is disposed on the COF package. One end of the panel unit is electrically connected to a first end of the COF package. The device assembly includes a control unit disposed below the panel unit. One end of the control unit is electrically connected to a second end of the COF package.