COG Display Panel Bonding With Variable Resin Thickness
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Solution Overview
Problem
The uneven distribution of driving terminals on a chip-on-glass (COG) display panel leads to a 'seesaw' effect during bonding, causing some terminals to raise and resulting in shallow donor conductivity and poor bonding, which affects the performance of the display panel.
Innovation Solution
A display panel design with a conductive resin of varying thickness, where the thickness in the bonding region is greater than in the region with driving terminals, ensuring proper electrical connection and compensation for terminal height differences, using anisotropic conductive adhesive to connect bonding pads and driving terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If driving terminals are placed only at one side of the driving chip to reduce bottom side frame size, then the bottom side frame size is reduced, but the driving terminals become unevenly distributed causing a seesaw effect during bonding
Solution Approach 1:
The conductive resin is designed with non-uniform thickness distribution, having greater thickness at regions corresponding to the first region (away from display region) and smaller thickness at regions corresponding to the second region (close to display region). This local variation in thickness compensates for the uneven terminal distribution, providing enhanced support where needed while maintaining the narrow frame design.
Solution Approach 2:
The thickness parameter of the conductive resin is varied across different regions to address the seesaw effect. By changing the thickness parameter locally rather than uniformly, the invention compensates for the uneven terminal distribution and prevents bonding defects while maintaining the reduced frame size.
2Length of moving object
If driving terminals are concentrated at one side, then the bottom side frame can be made super narrow, but some driving terminals raise during bonding and cannot be correctly bonded to the display panel
Solution Approach 1:
The conductive resin exhibits local quality variations in thickness to provide differential support during bonding. The greater thickness at the first region prevents terminal raising in areas with no terminals, while the smaller thickness at the second region accommodates the terminal distribution, ensuring reliable bonding across all terminals.
Solution Approach 2:
The conductive resin is designed with predetermined non-uniform thickness distribution before bonding occurs. This beforehand cushioning compensates for the expected seesaw effect and terminal raising, ensuring that all driving terminals maintain proper contact with the display panel during the bonding process.
3Ease of manufacture
If uniform thickness conductive resin is used, then the manufacturing process is simple, but the seesaw effect causes shallow donor conductivity and bonding failures
Solution Approach 1:
The conductive resin is manufactured with controlled local quality variations in thickness. This allows the resin to provide differential support where needed while maintaining overall manufacturing feasibility, achieving both adequate bonding precision and reasonable manufacturing simplicity.
Solution Approach 2:
The thickness parameter of the conductive resin is deliberately varied across different regions to achieve proper bonding. By controlling this parameter variation, the invention maintains manufacturing precision for bonding while keeping the manufacturing process relatively simple through controlled parameter changes rather than complex multi-component systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures correct bonding of the driving chip on the display panel, preventing shallow donor conductivity and enhancing the overall performance by maintaining even support and electrical connectivity.
Implementation Method 1
The conductive resin is an anisotropic conductive adhesive
Implementation Method 2
a conductive resin that is connected to the plurality of bonding pads and the driving chip
Data Source
AI summary
A display panel and a display device are disclosed. The display panel includes bonding pads placed in the bonding region, a driving chip, and a conductive resin connected to the bonding pads. The driving chip comprises a first region close to the display region and a second region away from the display region. The second region has a plurality of driving terminals. The driving terminals and the corresponding bonding pads are one-by-one electrically connected to each other. The thickness of at least a part of the conductive resin corresponding to the first region is set to be greater than the thickness of the conductive resin corresponding to the second region to compensate the height difference caused by the raise of the driving terminals when the driving chip is bonded. This ensures that the driving chip could be well bonded on the display panel and avoids the shallow donor conductivity.