Laminated Coil Component Interlayer Short Detection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional laminated coil components face challenges in detecting interlayer shorting defects, which can lead to undetected defects in the components, especially when used in modules with ICs, due to the small drop in inductance value, causing wastage of expensive ICs and difficulty in identifying defective components before they are integrated into modules.
Innovation Solution
The design includes a multilayer coil component with patterned conductor portions and interlayer connecting conductor portions that allow for easy detection of interlayer shorting by creating a significant drop in inductance value when a short occurs, enabling accurate identification of defects before ICs are mounted, using a configuration where the patterned conductor portions on adjacent layers overlap and are connected through interlayer connecting conductor portions on the same main surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If insulation layers are made thinner to achieve lower profiles and higher inductance values, then the number of insulation layers can be increased, but the insulation resistance drops due to dust particles entering during lamination, causing interlayer shorting
Solution Approach 1:
The patent applies preliminary action by forming a protective film on the insulation layers before lamination to prevent dust particles from entering and causing interlayer shorting. This preventive measure is taken in advance during the manufacturing process, addressing the reliability issue before it manifests in the final product.
2Reliability
If interlayer shorting occurs, then the component must be removed as defective, but the small drop in inductance value makes it difficult to detect the defect before module assembly
Solution Approach 1:
The patent applies local quality by creating a specific conductor configuration where patterned conductor portions on adjacent insulation layers overlap and are connected through interlayer connecting conductor portions. This localized structural arrangement ensures that interlayer shorting causes a significant inductance drop that can be easily detected, transforming a globally subtle defect into a locally detectable anomaly.
Solution Approach 2:
The patent applies parameter changes by designing the conductor configuration to amplify the inductance value change when interlayer shorting occurs. The specific arrangement of overlapping patterned conductor portions and interlayer connecting conductor portions ensures that a short circuit results in a large, easily measurable inductance drop, making defect detection straightforward.
3Loss of substance
If interlayer shorting is detected only after IC mounting, then expensive ICs are wasted, but the defect cannot be identified in the laminated coil component alone
Solution Approach 1:
The patent applies parameter changes by designing the conductor configuration to amplify the inductance value change when interlayer shorting occurs. The specific arrangement of overlapping patterned conductor portions and interlayer connecting conductor portions ensures that a short circuit results in a large, easily measurable inductance drop, making defect detection straightforward and enabling early identification before IC mounting.
Data Source
AI summary
In a laminated coil component, patterned conductor portions of a first coil portion and patterned conductor portions of a second coil portion are provided on respective insulation layers adjacent in a lamination direction, and include portions that overlap with each other when viewed in plan view. The insulation layers on which the patterned conductor portions of the second coil portion are provided are laminated between the plurality of insulation layers on which the patterned conductor portions of the first coil portion are provided. A first outer electrode to which the first coil portion is electrically connected and a second outer electrode to which the second coil portion is electrically connected are provided on the same main surface of a multilayer body.