Coil Component Electrode Recess Structure for Reliable Lead Bonding
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Solution Overview
Problem
The connection reliability between the coil unit and external electrodes in coil components is not adequately addressed, particularly in miniaturized electronic devices, where increased performance and compactness lead to challenges in maintaining strong electrical and mechanical bonds.
Innovation Solution
The coil component design includes recessed-cutout portions on the body surface filled with conductive resin layers, which are connected to exposed lead patterns and feature electrode layers, enhancing the bonding force between the coil unit and external electrodes, thereby improving connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the coil component is miniaturized to meet compact electronic device requirements, then the mounting area is reduced, but the connection reliability between coil unit and external electrodes deteriorates
Solution Approach 1:
The patent transitions from a planar electrode configuration to a three-dimensional structure by forming recessed portions on the body surface and filling them with conductive resin. This vertical dimensionality change allows the electrode to extend deeper into the body, increasing the bonding area and connection reliability without increasing the component's footprint area.
Solution Approach 2:
The conductive resin is nested within the recessed portions formed on the body surface, creating a hierarchical structure where the electrode material is embedded within the ceramic body. This nesting approach maximizes the use of available space and strengthens the connection between the coil unit and external electrodes.
2Reliability
If the bonding area between external electrodes and coil unit is increased to improve connection reliability, then the manufacturing complexity increases
Solution Approach 1:
The recessed portions are pre-formed on the body surface before the conductive resin is applied. This preliminary action creates prepared receptacles that guide the conductive resin to the exact locations where enhanced bonding is needed, simplifying the subsequent electrode formation process while ensuring reliable connections.
Solution Approach 2:
Instead of uniformly increasing the electrode area across the entire surface, the patent applies the conductive resin locally within the recessed portions. This localized approach concentrates the bonding enhancement where it is most needed (at the coil unit connection points) without unnecessarily complicating the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves the bonding force between the coil unit and external electrodes, ensuring reliable electrical connections and reducing contact resistance, even in compact electronic devices.
Implementation Method 1
conductive resin layers respectively filling the first and second recessed-cutout portions to be in contact with the first and second lead patterns
Data Source
AI summary
A coil component includes a body having a first surface and including first and second recessed-cutout portions spaced apart from each other on the first surface of the body, a support substrate, a coil unit disposed on the support substrate to be perpendicularly to the first surface of the body, and first and second external electrodes spaced apart from each other on the first surface of the body and connected to first and second lead patterns of the coil unit, respectively. The first and second external electrodes include conductive resin layers filling the first and second recessed-cutout portions to be in contact with the first and second lead patterns, each of the conductive resin layers having a first surface exposed to the first surface of the body, and the first and second external electrodes further include electrode layers disposed on the first surfaces of the conductive resin layers.