Transformers/Inductances Casings TRIZ Cases
- Sandwich TLVR Power Module Layout for Heat-Dense Current Loads
A stacked transformer-pack layout improves heat flow and power density in TLVR modules for space-limited, high-current CPU and GPU loads.
- Litz-Wire Hollow Coil Packaging for High-Frequency Loss Reduction
Twisted insulated Litz wire and magnetic plastic packaging cut skin-effect loss, lower AC impedance, and help prevent wire breakage.
- Wound Coil Component Layout for Low-Profile Miniaturization
Surface accommodation grooves relocate coil ends to preserve flux area, enabling thinner, smaller wound coil components without losing electrical characteristics.
- Potted Inductive Component Layout to Protect the Magnetic Core
By separating the magnetic core from the potting material, this inductive component reduces thermal stress while preserving insulation and stable electrical properties.
- Rotary Differential Transformer Coil Reduction for Small-Airgap Assembly
Wider stator slots and fewer coils ease small-airgap assembly, reduce breakage risk and cost, and preserve linear angular voltage output.
- Multi-Layer Power Module Structure for Lower Loss and Heat Dissipation
Vertical PCB stacking cuts inductor loss, improves heat transfer through the system board, and creates room for more output capacitors.
- Coil Component Structure for High-Frequency Impedance Peaks
Localized permeability and permittivity regions create a high-frequency impedance peak while maintaining inductance in a coil component.
- Coil Component Insulation Layout for Magnetic Volume Retention
A non-uniform insulating layer keeps critical end surfaces thicker while preserving magnetic material volume in miniaturized coil components.
- Coil Winding Structure With Side-Surface Wire Intersection
Placing wire intersection on the winding core side surface eases bending near thin flanges and protects wire-terminal connection quality.
- 3D Embedded Inductor Package With Ferrite Toroid Hybrid Wiring
Copper-post hybrid wiring and a ferrite toroid boost embedded spiral inductor performance while shrinking package size and profile.
- Symmetrical Dual-Coil Reactor Layout for Simpler PCB Wiring
Symmetrical same-shape coils align terminal parts to simplify PCB connections, ease manufacturing, and reduce current waveform variation.
- Coil Via Pad Structure for Lower-Resistance Miniature Inductors
Via pad portions enlarge the effective via opening in a substrate coil, cutting resistance while supporting smaller inductors.
- Curved Transformer Housing for Eddy Current and Noise Reduction
Curved tank wall portions aligned with magnetic field lines cut transformer eddy currents, losses, vibration, and load noise.
- Overlapping Bobbin Coil Layout for Compact High-Voltage Insulation
Corrugated intermediate and cover parts extend creepage distance in an overlapping bobbin coil, preserving voltage resistance in a compact layout.
- Insulation Frame Coil Structure for Miniaturized Magnetic Components
An insulation frame separates the terminal from the magnetic core, preserving coil insulation in compact layouts and improving reliability.
- Power Inductor Insulation Structure to Prevent Plating Spread
Insulating layers on the top and side surfaces block plating spread, preserve inductance, and support compact power inductor design.
- Coil Component Electrode Recess Structure for Reliable Lead Bonding
Recessed cutouts filled with conductive resin increase coil lead bonding area, improving external electrode connection reliability in compact components.
- High-Permittivity Isolation Layers for Integrated Magnetic Assemblies
High-permittivity dielectric layers smooth electric fields at conductor corners, reducing breakdown risk in compact integrated magnetic assemblies.
- Composite Magnetic Core Structure for Compact High-Inductance Rectifiers
A ferrite-alloy composite core boosts rectifier inductance while shrinking magnetic element volume and improving power conversion efficiency.
- Coil Component Recess Marking for Reliable Mounting Recognition
A recessed resin marking improves coil mounting-direction recognition by boosting contrast, reducing diffuse reflection errors, and strengthening adhesion.