Sandwich TLVR Power Module Layout for Heat-Dense Current Loads
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Solution Overview
Problem
Existing power modules face challenges in achieving high-power density, high-efficiency, and effective heat dissipation in space-constrained environments, particularly for high-load current applications in modern GPUs and CPUs.
Innovation Solution
A sandwich structure TLVR power module is designed, featuring a transformer pack with a magnetic core, primary and secondary windings, and power device chips mounted on substrates to optimize space usage and heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of power modules is reduced to improve integration, then integration is improved, but heat conduction capability deteriorates
Solution Approach 1:
The patent transitions from planar substrate mounting to three-dimensional sandwich structure, stacking transformer packs and substrate assemblies in multiple layers. This vertical dimensionality change enables compact footprint while maintaining thermal pathways through the stacked configuration, resolving the contradiction between small size and heat conduction capability
Solution Approach 2:
The patent introduces thermal interface materials and thermally conductive substrates as intermediary elements between power devices and heat sinks. These intermediaries efficiently transfer heat from compact power devices to external cooling structures, enabling effective heat conduction despite the reduced overall module size
2Power
If higher current is required to meet load demands, then power output is improved, but heat dissipation difficulty increases
Solution Approach 1:
The patent replaces traditional air-cooling or simple heat sink mechanisms with an integrated liquid cooling system featuring cooling channels and coolant flow. This substitution provides superior heat dissipation performance for high-current applications, enabling higher power output without excessive temperature rise
Solution Approach 2:
The patent employs thermally conductive substrates and heat dissipation materials with high thermal conductivity in the heat sink structure. These composite materials efficiently conduct and dissipate heat generated by high-current operation, resolving the contradiction between high power output and heat dissipation difficulty
3Power
If power density is increased to reduce module size, then integration is improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the power module into modular transformer packs and substrate assemblies that can be manufactured separately and then assembled. This segmentation enables standardized mass production of individual modules while achieving high power density through their stacked configuration, reducing overall manufacturing complexity
Solution Approach 2:
The patent combines multiple functional components (transformer, substrate, power devices, cooling structures) into an integrated sandwich structure assembly. This merging approach achieves high power density while streamlining manufacturing through unified assembly processes, balancing integration benefits with manufacturing feasibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-power density and efficiency while providing excellent heat dissipation capabilities, suitable for space-constrained environments with high-load current requirements.
Implementation Method 1
The transformer pack includes a magnetic core, a first primary winding, a second primary winding, a first secondary winding, a second secondary winding... Each one of the first primary winding and the second primary winding passes through the magnetic core
Implementation Method 2
The first magnetic core part is placed in a gap between the first primary winding and the first secondary winding, and the second magnetic core part is placed in a gap between the second primary winding and the second secondary winding
Data Source
AI summary
A power module, having: a transformer pack; a top substrate mounted on the transformer pack; and two power device chips mounted on the top substrate, wherein each one of the power device chips has at least one pin connected to the transformer pack via the top substrate; wherein the transformer pack has a magnetic core, a first primary winding and a second primary winding, a first secondary winding and a second secondary winding, a first magnetic core part and a second magnetic core part, and wherein each one of the primary windings passes through the magnetic core, the first secondary winding is close to the first primary winding with the first magnetic core part in between, and the second secondary winding is close to the second primary winding with the second magnetic core part in between.