Power Inductor Insulation Structure to Prevent Plating Spread
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Solution Overview
Problem
There is a need for a compact power inductor with high efficiency and performance in electronic products, particularly smartphones, that minimizes burring, prevents plating spread, maintains inductance, and enhances insulation while being miniaturized.
Innovation Solution
A coil component design featuring a body with opposing surfaces, a support member, a coil unit with opposing coil patterns and lead patterns, and insulating layers that cover the surfaces and side surfaces, including external electrodes connected to the lead patterns, to prevent burring, plating spread, and maintain insulation while allowing miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the coil component is miniaturized for compact electronic products, then the size is reduced, but the insulation property may deteriorate and plating spread may occur
Solution Approach 1:
The patent applies local quality by providing enhanced insulation specifically at critical locations where plating spread may occur. The insulating layer is strategically positioned between the coil pattern and external electrodes, and the second insulating layer covers the side surface of the body, creating localized insulation zones that prevent plating spread without requiring overall component enlargement.
Solution Approach 2:
The patent introduces an additional dimensional layer by adding a second insulating layer that covers the side surface of the body, extending the insulation protection from the top surface into the vertical dimension. This multi-layer, multi-dimensional insulation structure prevents plating spread pathways without increasing the planar footprint of the component.
2Volume of moving object
If the coil component is miniaturized for compact electronic products, then the size is reduced, but plating spread may occur
Solution Approach 1:
The patent implements preliminary anti-action by pre-establishing insulating barriers before plating processes occur. The first insulating layer is formed between the coil pattern and external electrodes, and the second insulating layer covers the side surface, creating preventive barriers that block plating spread before it can occur during manufacturing.
Solution Approach 2:
The insulating layers serve as intermediary elements between conductive components (coil pattern and external electrodes). These intermediary layers physically separate the conductive elements and prevent direct contact that would allow plating spread, acting as mediating barriers without interfering with the electrical function of the component.
3Object-generated harmful factors
If insulation layers are added to prevent plating spread, then plating spread is prevented, but the device complexity increases
Solution Approach 1:
The insulating layers serve multiple functions simultaneously: they provide electrical insulation between conductive elements, prevent plating spread during manufacturing, and serve as structural components of the finished device. The second insulating layer covering the side surface provides both insulation and structural integrity, reducing the need for additional separate components.
Data Source
AI summary
A coil component includes: a body having a first surface and a second surface opposing each other, and a side surface connecting the first surface and the second surface to each other; a support member disposed in the body; a coil unit disposed in the body and including a coil pattern disposed on the support member, and first and second lead patterns respectively extending from the coil pattern and exposed to the first surface of the body; a first insulating layer disposed on the first surface of the body and having first and second openings exposing at least a portion of the first and second lead patterns, respectively; and a second insulating layer covering the side surface of the body.