Multi-Layer Power Module Structure for Lower Loss and Heat Dissipation
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Solution Overview
Problem
Conventional power modules face challenges in reducing power loss, thermal resistance, and enhancing heat dissipation efficiency, while also being unable to accommodate more output capacitors due to space restrictions.
Innovation Solution
The power system incorporates a power module with a multi-layered structure, featuring a first and second printed circuit board, a magnetic core assembly, and conductive parts that reduce thermal resistance and increase heat dissipation efficiency, allowing for more output capacitors and improved mechanical pressure resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the output current of the power module is increased to meet the requirements of high-current central processing units, then the power supply capability is improved, but the output voltage drop becomes larger and power loss increases
Solution Approach 1:
The patent transitions from a conventional single-layer PCB layout to a three-dimensional multi-layer stacked structure. The power module comprises a first PCB layer with switch elements, a second PCB layer with output inductors, and a third PCB layer with output capacitors, vertically stacked and interconnected through conductive vias. This dimensional change reduces current path length and resistance, thereby reducing power loss while maintaining high current capability.
Solution Approach 2:
The patent integrates multiple functional components (switch elements, output inductors, output capacitors) into a single compact power module assembly. The output inductors are formed by copper bars magnetically coupled with a magnetic core, and the output capacitors are mounted on the same PCB structure, merging these components into one integrated unit that reduces overall resistance and improves power efficiency.
2Volume of moving object
If the volume of the electronic device is reduced through miniaturization, then the device size is decreased, but the heat dissipation capability deteriorates due to reduced space for heat sinks and thermal management components
Solution Approach 1:
The patent utilizes vertical stacking of PCB layers to achieve three-dimensional heat dissipation. Heat generated by switch elements on the first layer can be conducted through the PCB structure to external heat sinks, while the compact horizontal footprint is maintained. The multi-layer structure provides multiple thermal pathways, improving heat dissipation efficiency without increasing device volume.
Solution Approach 2:
The PCB structure itself acts as a thermal intermediary, conducting heat from the switch elements through the board layers to external heat dissipation mechanisms. The copper traces and ground planes on each layer serve as thermal pathways, efficiently transferring heat away from the power switching components while maintaining a compact form factor.
3Quantity of substance
If the number of output capacitors is increased to improve power supply stability, then the capacitance capacity is enhanced, but the available space for capacitor installation is reduced due to space restrictions
Solution Approach 1:
The patent moves capacitor installation from a two-dimensional surface mounting approach to a three-dimensional multi-layer configuration. Output capacitors are mounted on the third PCB layer and interconnected through vertical vias, utilizing the vertical dimension to accommodate more capacitors without increasing the horizontal footprint of the power module.
Solution Approach 2:
The power module employs a nested arrangement where output capacitors are positioned within the vertical space above the main circuit board area. The multi-layer PCB structure allows capacitors to be nested in the vertical dimension, effectively increasing capacitor capacity while maintaining a compact horizontal layout that fits within the device volume constraints.
4Temperature
If the thermal resistance between heat sources and the system board is reduced to improve heat transfer, then the heat dissipation efficiency is enhanced, but the complexity of the thermal management structure increases
Solution Approach 1:
The patent combines the electrical circuit board with the thermal management structure. The PCB layers serve dual functions as both electrical interconnection media and thermal conduction pathways. The copper traces, ground planes, and vias that provide electrical connectivity also act as thermal pathways, reducing thermal resistance without requiring separate thermal management components.
Solution Approach 2:
The PCB structure is designed to perform multiple functions simultaneously: electrical interconnection, signal transmission, and thermal conduction. The same copper layers and vias that provide electrical pathways also serve as thermal pathways, eliminating the need for additional thermal management structures and reducing overall system complexity while improving heat transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces power loss in output inductors, enhances heat dissipation, and allows for suitable inductance and increased output capacitor capacity, thereby addressing the limitations of conventional power modules.
Implementation Method 1
The magnetic core 82 is disposed on the printed circuit board 83. The printed circuit board 83 is disposed on the first surface 9a of the system board 9. The heat from the power module 8 can be transferred to the system board 9 through the printed circuit board 83.
Implementation Method 2
the heat is dissipated away through a heat dissipation mechanism (not shown) of the system board 9
Implementation Method 3
The copper bars 84, 85 are magnetically coupled with the magnetic core 82 to form the output inductors of the power module 8
Implementation Method 4
A plurality of switch elements are disposed on the printed circuit board 83 and located in the gap 86
Data Source
AI summary
A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.