Coil Electronic Component Plating Method for Low DC Resistance
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Solution Overview
Problem
Existing methods for manufacturing thin film inductors face limitations in increasing the cross-sectional area of internal coil parts to reduce DC resistance and improve inductance, as they often result in increased risk of short circuits, limited coil turns, and difficulties in forming high aspect ratio structures due to exposure and plating resist limitations.
Innovation Solution
A coil electronic component with a magnetic body featuring patterned insulating films, a first plating layer formed by isotropic plating between these films, and a second plating layer formed through anisotropic plating, allowing for a high aspect ratio structure with uniform thickness distribution and reduced defects by patterning insulating films before plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the width of the coil is increased to decrease DC resistance, then the DC resistance decreases, but the risk of short circuit between neighboring coils increases and the number of coil turns is limited
Solution Approach 1:
The patent transitions from increasing coil width (lateral dimension) to increasing coil thickness (vertical dimension) to reduce DC resistance. By forming multiple plating layers stacked in the thickness direction, the coil achieves higher cross-sectional area without expanding laterally, thus maintaining adequate spacing between neighboring coils and avoiding short circuits.
Solution Approach 2:
The patent divides the coil formation process into multiple plating stages, creating several plating layers that are stacked in the thickness direction. Each plating layer is formed through separate plating processes, allowing the total coil thickness to be accumulated incrementally while maintaining control over each individual layer's formation.
2Length of moving object
If the thickness of the plating resist is increased to form thicker coil, then the coil thickness increases, but the lower portion of the plating resist is not smoothly exposed
Solution Approach 1:
The patent segments the coil thickness formation into multiple plating layers, where each layer is formed through separate plating processes with thinner plating resists. This avoids the exposure problems associated with single thick plating resist while achieving the desired total coil thickness through stacking multiple thinner layers.
Solution Approach 2:
The patent forms a seed pattern layer before subsequent plating layers, establishing a foundation that enables controlled growth of additional plating layers. This preliminary structure allows each subsequent plating process to start from a defined base, ensuring uniform exposure and plating thickness for each incremental layer.
3Length of moving object
If the width of the plating resist is increased to maintain thick plating resist form, then the interval between neighboring coils increases, but DC resistance and inductance characteristics deteriorate
Solution Approach 1:
The patent resolves the conflict between plating resist width and coil thickness by shifting the thickness accumulation to the vertical stacking of multiple plating layers rather than relying on single thick plating resist. This allows narrow plating resist widths (maintaining tight coil spacing) while achieving thick coils through vertical stacking.
4Loss of energy
If the aspect ratio of internal coil part is increased to decrease DC resistance, then the DC resistance decreases, but the uniformity of coil shape decreases and insulating layer formation becomes difficult
Solution Approach 1:
The patent segments the high aspect ratio coil formation into multiple plating layers with moderate individual aspect ratios. Each plating layer maintains better shape uniformity and facilitates insulating layer formation, while the stacked combination achieves the overall high aspect ratio and low DC resistance of the complete coil structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the implementation of low DC resistance and improved inductance characteristics by increasing the cross-sectional area and aspect ratio of the coil parts, while minimizing defects and maintaining uniformity in thickness differences, thus enhancing the electrical and insulating properties of the coil electronic component.
Implementation Method 1
a first plating layer formed between the patterned insulating films by isotropic plating
Implementation Method 2
a second plating layer formed through anisotropic plating
Data Source
AI summary
A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.