Coil Component Via Segmentation for Resistance Loss Reduction
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Solution Overview
Problem
Current coil components face issues with high resistance loss due to current bottlenecks and complex manufacturing processes, particularly in high-frequency applications, where the concentration of vias leads to increased current density and resistance loss, and the alignment of vias becomes difficult.
Innovation Solution
A coil component design featuring alternately disposed first and second coil patterns connected by a single via per pair, with a simplified manufacturing process that reduces the number of vias and maintains low current density, thereby preventing the bottleneck phenomenon and minimizing resistance loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple vias are used to connect coil patterns, then electrical connection is achieved, but current density increases and resistance loss increases
Solution Approach 1:
The coil structure is divided into multiple independent coils, each with its own via connection. This segmentation distributes the current flow across multiple separate paths, reducing current density in each individual via and consequently reducing resistance loss while maintaining reliable electrical connection.
2Reliability
If multiple vias are used to connect coil patterns, then electrical connection is achieved, but manufacturing complexity increases due to via alignment difficulty
Solution Approach 1:
By segmenting the coil into independent units with one via per coil, the via alignment requirement is simplified from aligning multiple vias across the entire coil structure to aligning a single via per coil segment, significantly reducing manufacturing complexity.
3Ease of manufacture
If conventional coil structure is used, then manufacturing process is complex, but current bottleneck phenomenon occurs
Solution Approach 1:
The conventional coil structure is segmented into multiple independent coils with individual via connections. This eliminates the current bottleneck phenomenon by providing multiple parallel current paths, reducing current density and resistance loss.
Solution Approach 2:
The patent transitions from a planar coil structure to a three-dimensional stacked structure with insulating layers, allowing coils to be arranged in multiple layers. This dimensional change enables parallel current paths without increasing planar complexity, simplifying the manufacturing process while reducing resistance loss.
Data Source
AI summary
A coil component includes a body including a plurality of first and second coil patterns, which are alternately disposed, and insulating layers disposed therebetween. The first coil patterns may be connected to the second coil patterns adjacent to the first coil patterns by vias, a plurality of coils including at least one each of the first and second coil patterns may be formed, and the plurality of coils may be connected in parallel to each other.