Printed Inductances TRIZ Cases
- Thick Surface Conductor Layout for Wider Trimming Adjustment
Thicker surface conductors than internal layers enable easier trimming, broader electrical adjustment, smaller components, and resin protection.
- Stacked Glass Package Substrates for Thermal Stress and Power Delivery
Stacked glass layers with different CTEs and buffer materials limit crack growth while CMILs and PMVs maintain power delivery through the substrate.