Stacked Glass Package Substrates for Thermal Stress and Power Delivery
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Solution Overview
Problem
Glass cores in package substrates are prone to seware failures due to cracks propagating from defects on their edges caused by thermal expansion mismatch between glass and build-up regions, leading to separation into two pieces.
Innovation Solution
Implementing multiple glass cores with different coefficients of thermal expansion (CTE) stacked symmetrically or asymmetrically, with buffer materials to absorb stress, and using coaxial magnetic inductor loops (CMILs) and plated magnetic vias (PMVs) for power delivery through the glass cores.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If multiple glass cores with different CTE are stacked, then thermal stress is reduced and mechanical stability is enhanced, but device complexity increases
Solution Approach 1:
Glass cores with different coefficients of thermal expansion (CTE) are selectively positioned within the stack based on their CTE parameters. By matching CTE values to adjacent materials and creating a gradient structure, thermal stresses are minimized and mechanical stability is enhanced. The systematic arrangement of varying CTE parameters resolves the contradiction by transforming a potential source of stress into a stress-mitigating design feature
Solution Approach 2:
The package substrate employs a composite structure combining multiple glass cores with different CTE values and buffer materials in a layered stack. This composite approach allows optimization of thermal and mechanical properties through material selection and arrangement, achieving enhanced mechanical stability while managing the complexity through standardized composite material design principles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces stress-induced crack propagation and enhances mechanical stability while maintaining efficient power delivery and signal integrity in package substrates.
Implementation Method 1
different coefficients of thermal expansion
Implementation Method 2
buffer materials to absorb stress
Implementation Method 3
coaxial magnetic inductor loops (CMILs) and plated magnetic vias (PMVs) for power delivery
Data Source
Figure 1
Figure 2A~2B
Figure 3~7
AI summary
Systems, apparatus, articles of manufacture, and methods for power delivery through package substrates with stacks of glass layers having different coefficients of thermal expansion are disclosed. An example substrate for an integrated circuit package includes: a first glass layer having a first coefficient of thermal expansion (CTE); a second glass layer having a second CTE, the second CTE different from the first CTE; a conductive material extending through a first hole in the first glass layer and a second hole in the second glass layer; and a magnetic material between an inner wall of the first hole and the conductive material.