Flexible Coil Substrate Layout for High Space Factor Motors
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Solution Overview
Problem
Existing coil substrates face challenges in achieving a balance between preventing short-circuiting and maximizing space factor, which affects the performance and efficiency of motors.
Innovation Solution
A coil substrate design with a flexible resin substrate featuring a wiring structure where the ratio of the thickness of the first layer to the second layer of the wiring coverage satisfies 1.0 < T1/T2 ≤ 1.4, ensuring high electrical connectivity and a suitable space factor, thereby improving motor performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wiring width is increased to reduce resistance, then the electrical connectivity is improved, but the space factor decreases and the motor size increases
Solution Approach 1:
The patent applies parameter changes by precisely controlling the wiring width within 60-400 μm and the thickness ratio T1/T2 within 1.01-1.4, optimizing the balance between electrical connectivity and space utilization. This quantitative parameter optimization allows the motor to achieve low resistance while maintaining compact dimensions.
2Reliability
If the wiring thickness ratio T1/T2 is increased to prevent short-circuiting, then the electrical insulation is improved, but the space factor decreases and the motor becomes larger
Solution Approach 1:
The patent optimizes the thickness ratio parameter T1/T2 within the range of 1.01-1.4, which provides sufficient electrical insulation to prevent short-circuiting between adjacent coils while minimizing the increase in motor size. This precise parameter control resolves the contradiction between reliability and compactness.
3Productivity
If the wiring density is increased to improve motor performance, then the power density is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent establishes specific parameter ranges for wiring width (60-400 μm) and thickness ratio (1.01-1.4) that optimize power density while maintaining feasible manufacturing precision. These quantified parameters enable high-density wiring arrangements without excessively stringent manufacturing requirements.
Data Source
AI summary
A coil substrate includes a flexible substrate having a first surface and a second surface on the opposite side with respect to the first surface, a coil including a wiring and formed on the first surface and/or second surface of the flexible substrate, and a resin insulating layer covering the wiring of the coil formed on the first surface and/or second surface of the flexible substrate. The coil is formed such that the wiring has a first layer and a second layer covering an outer surface of the first layer and that the second layer has a first portion covering an upper surface of the first layer and a second portion covering a side surface of the first layer, and the wiring of the coil is formed such that the wiring has a width in a range of 60 μm to 400 μm and that a ratio T1/T2 of a thickness T1 of the first portion to a thickness T2 of the second portion satisfies 1.0<T1/T2≤1.4.