Cold Plate Integrating Optical Paths and Power Delivery for ICs
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Solution Overview
Problem
As ASIC process nodes advance and power requirements increase, delivering power to electronic and photonic integrated circuits while managing thermal challenges and integrating optical signals becomes complex, especially when packaged with a cold plate.
Innovation Solution
The integration of power and optical signal distribution through a cold plate, where an optical path and electrical path are formed to transmit power from Point-of-Load (POL) modules to electronic components and optical signals to photonic elements, using waveguides and connectors that can handle multi-phase pulse power and optical signals, with the cold plate comprising power delivery blocks and vias for efficient power transfer and optical path creation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power delivery is increased to meet higher ASIC power requirements, then power delivery capability is improved, but thermal challenges worsen
Solution Approach 1:
The patent combines power delivery blocks, optical path blocks, and cold plate cooling structures into a single integrated package. The power delivery blocks are positioned in thermal contact with the cold plate, allowing simultaneous power delivery and heat dissipation through the same structural footprint, thus improving power delivery capability while managing thermal challenges.
Solution Approach 2:
The cold plate serves as an intermediary thermal management component between the power delivery blocks and the ambient environment. It conducts heat away from the high-power ASIC regions, enabling sustained high power delivery without excessive temperature rise.
2Device complexity
If optical signals are integrated with power delivery through cold plate, then integration complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The cold plate structure is designed to serve multiple functions simultaneously: thermal management, power delivery, and optical signal transmission. By integrating optical path blocks within the cold plate structure, the patent reduces the number of separate components and interfaces, thereby reducing overall integration complexity despite increased manufacturing precision requirements.
3Temperature
If cold plate is used for thermal management, then cooling effectiveness is improved, but power delivery to electronic integrated circuit becomes more difficult
Solution Approach 1:
The patent merges power delivery blocks directly with the cold plate structure, eliminating the need for separate power delivery paths. The power delivery blocks are positioned to conduct both electrical power and thermal energy through the cold plate, thus maintaining effective cooling while simplifying power delivery architecture.
4Power
If higher power is delivered to ASIC, then power requirements are met, but thermal management challenges increase
Solution Approach 1:
The patent combines multiple thermal management functions into the cold plate structure, including heat conduction, convection, and integration with optical path blocks. This integrated approach manages thermal challenges from high-power ASIC operation without requiring additional separate thermal management systems, thus meeting power requirements while controlling thermal management complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient power delivery and optical signal transmission to both electronic and photonic integrated circuits, maintaining effective cooling and minimizing thermal impact, thus addressing the challenges of increasing power demands and integration complexities.
Implementation Method 1
an optical path extending through the cold plate and optically coupled to the photonic integrated circuit for transmitting an optical signal
Implementation Method 2
electrical path extending through the cold plate for transmitting power from Point-of-Load (POL) modules to an electronic integrated circuit
Implementation Method 3
delivering power is becoming more challenging. Higher power distribution also presents additional thermal challenges
Data Source
AI summary
In one embodiment, an apparatus includes a cold plate comprising a first side and a second side, a photonic integrated circuit connected to a substrate positioned on the second side of the cold plate, and an optical path extending through the cold plate and optically coupled to the photonic integrated circuit for transmitting an optical signal between the photonic integrated circuit and the first side of the cold plate.