Cold Plate Recessed Base for Conductive Thermal Management
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Solution Overview
Problem
Conductive thermal management is required for electronic devices that cannot be exposed to ambient atmosphere for convective cooling, necessitating an effective method to transfer heat from these devices to a coolant within a cold plate.
Innovation Solution
A cold plate design featuring a recessed base machined into its surface, bonded to a base copper plate, with a coolant cavity and inlet/outlet for coolant flow, along with machined edges and holes for fastening electronic assemblies, facilitates conductive heat transfer to the coolant, utilizing materials like aluminum or aluminum alloy for enhanced thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If electronic devices are mounted on a cold plate with a flat surface, then manufacturing is simpler, but heat transfer efficiency is reduced due to larger thermal interface material thickness
Solution Approach 1:
The cold plate incorporates a recessed base that creates a localized non-flat region directly beneath the electronic device mounting area. This local modification reduces the thickness of the thermal interface material only where needed for optimal heat transfer, while the rest of the cold plate maintains its simple flat structure for ease of manufacturing.
2Weight of moving object
If the cold plate surface is made thinner to reduce weight, then weight decreases, but structural strength and heat conduction capability worsen
Solution Approach 1:
The recessed base creates a localized thin region only where the electronic device is mounted, allowing weight reduction in the critical heat transfer area. The surrounding areas of the cold plate maintain their original thickness to preserve overall structural strength and heat conduction pathways.
Solution Approach 2:
The cold plate utilizes aluminum or aluminum alloy materials that provide high strength-to-weight ratio and excellent thermal conductivity, enabling the plate to be thinner while maintaining both structural integrity and heat transfer capability.
3Temperature
If a recessed base is machined into the cold plate to improve heat transfer, then heat dissipation efficiency improves, but manufacturing complexity and cost increase
Solution Approach 1:
The recessed base is a localized feature machined only in the specific area where the electronic device will be mounted. This approach minimizes the overall machining complexity compared to creating a complex three-dimensional surface across the entire cold plate, while still achieving the heat transfer benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient heat dissipation from electronic components like power dies and diodes, maintaining junction temperatures below maximum levels and supporting high-power applications in various environments, including deep space and underwater scenarios.
Implementation Method 1
conductive thermal management must be employed
Implementation Method 2
convective heat transfer can be used to cool these heat-generating devices
Data Source
AI summary
A cold plate includes a first side with a first surface, and a second side, opposite the first side. A coolant cavity is formed between the first side and the second side. A recessed base is machined into the first surface of the first side. The recessed base is bonded to a base copper plate and is a thinnest portion of the first surface.