Integrated Cold Plate Cooling for High-Heat-Flux Semiconductor Dies
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Solution Overview
Problem
Existing cooling methods for semiconductor devices, such as metal heat sinks, are inadequate for high heat flux scenarios, leading to overheating and potential circuit failures due to insufficient thermal conductivity and the need for isolation components that reduce efficiency.
Innovation Solution
A direct liquid cooling system where semiconductor devices are mounted directly on a die substrate with integrated cold plates containing enclosed channels for cooling liquid circulation, allowing for improved thermal dissipation and eliminating the need for isolation layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional metal heat sinks are used for cooling semiconductor devices, then the structure is simple and easy to manufacture, but the cooling efficiency is insufficient for high heat flux scenarios
Solution Approach 1:
The patent applies hydraulic cooling by circulating liquid through enclosed channels within the cold plate to efficiently remove heat from semiconductor devices. The cooling liquid flows through the channels, absorbing heat directly at the heat-generating components, thereby resolving the contradiction between structural simplicity and cooling efficiency for high heat flux applications.
Solution Approach 2:
The patent merges the semiconductor device mounting substrate with the cooling system by integrating the cold plate and enclosed cooling channels directly into the substrate structure. This combination eliminates the need for separate heat sinks and isolation layers, achieving both high cooling efficiency and structural simplicity simultaneously.
2Reliability
If isolation components are used to separate semiconductor devices and cooling components, then electrical insulation is provided, but thermal resistance increases and efficiency is reduced
Solution Approach 1:
The patent combines the electrical insulation function and thermal conduction function into a single integrated substrate structure. The substrate material itself provides both electrical insulation properties while maintaining high thermal conductivity to the cooling channels, eliminating the need for separate isolation components that would increase thermal resistance.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support for semiconductor devices, electrical insulation between components, and thermal conduction to the cooling system. This multi-functionality eliminates the need for dedicated isolation layers, reducing thermal resistance while maintaining electrical insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively maintains semiconductor devices at predetermined temperatures, enhancing cooling efficiency and preventing overheating, thereby improving reliability and performance.
Implementation Method 1
the cold plate may be positioned proximate to the semiconductor device and may be configured to at least partially dissipate heat using the cooling liquid from the semiconductor device
Implementation Method 2
The inlet may be configured to allow inflow of the cooling liquid into the enclosed channel and the outlet may be configured to allow outflow of the cooling liquid from the enclosed channel. The cooling liquid may be configured to circulate within the enclosed channel.
Data Source
AI summary
A system and associated method for direct liquid cooling of semiconductor devices. The system includes at least one semiconductor device is positioned on a die substrate and at least one cold plate disposed within the die substrate and containing a cooling liquid. The cold plate is positioned proximate to the semiconductor device and configured to at least partially dissipate heat using the cooling liquid from the semiconductor device during operation of the semiconductor device.