Cold Spray Conductive Layer on Resin Casing
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Solution Overview
Problem
The increasing number of electrical devices in automobiles leads to a rise in the complexity and weight of wire harnesses, necessitating a method to reduce the amount of wiring required.
Innovation Solution
A method of forming a circuit body on a resin casing using a cold spray method with metal powder and inert gas, where a first layer is sprayed followed by a second layer with higher lamination density, and an insulating resin is applied, allowing for direct mounting of circuit components, thereby reducing wire usage and enhancing conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire harnesses are used to supply power and control signals to electrical devices, then the electrical devices can be supplied with power and control signals, but the weight and space occupied by the wire harness increase
Solution Approach 1:
The patent merges the power supply function and control signal transmission function into a single integrated circuit board structure. The circuit board directly mounts both power supply circuits and control signal circuits, eliminating the need for separate wire harnesses to perform these functions. This consolidation reduces the overall weight and space required while maintaining all necessary electrical connections.
Solution Approach 2:
The patent extracts the wire harness function entirely by replacing it with a circuit board-based system. Instead of using traditional wire harnesses to supply power and control signals, the invention uses a circuit board with integrated circuits that directly provide these functions, thereby removing the weight and space burden of wire harnesses from the vehicle system.
2Adaptability or versatility
If the number of wire harnesses increases to accommodate more electrical devices, then more electrical devices can be supported, but the labor required for manual assembly increases
Solution Approach 1:
The patent combines multiple circuit functions (power supply, control signals, grounding) into a single circuit board assembly. This integration allows the system to support multiple electrical devices through one unified structure rather than requiring multiple separate wire harnesses, thereby reducing assembly complexity and labor while maintaining adaptability to support various electrical devices.
Solution Approach 2:
The circuit board is designed with multi-functionality to perform power supply, control signal transmission, and grounding functions simultaneously. This universal design allows a single circuit board to support multiple electrical devices with different functions, replacing what would traditionally require multiple specialized wire harnesses, thus reducing assembly labor while maintaining versatility.
3Ease of manufacture
If a conductive portion is formed by spraying a single layer onto the resin casing, then the process is simpler, but the adhesion and conductivity are insufficient
Solution Approach 1:
The patent uses a composite structure with two distinct layers: a first layer for adhesion to the resin casing and a second layer for conductivity. This composite material approach combines the advantages of both layers - the first layer ensures strong bonding to the substrate while the second layer provides excellent electrical conductivity, achieving both reliability and manufacturability.
Solution Approach 2:
The patent applies different material properties to different layers of the conductive portion. The first layer is optimized for adhesion to the resin casing, while the second layer is optimized for electrical conductivity. This local quality differentiation ensures that each layer performs its specific function optimally, achieving both strong adhesion and high conductivity without compromising either property.
4Reliability
If wires are used to connect circuit components, then the circuit components can be electrically connected, but the amount of wiring and complexity increase
Solution Approach 1:
The patent merges the electrical connection function of separate wires into an integrated circuit board structure. Circuit components are mounted directly on the circuit board, which provides all necessary electrical connections through its conductive traces and pathways. This eliminates the need for separate wire connections between components, reducing wiring complexity while maintaining reliable electrical connectivity.
Solution Approach 2:
The patent extracts the wiring function by replacing traditional wire-based connections with a circuit board-based connection system. The circuit board serves as the interconnection medium, eliminating the need for individual wires to connect circuit components. This extraction of the wiring function into an integrated structure significantly reduces device complexity while maintaining all necessary electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the amount of wiring needed, simplifies assembly, and achieves weight reduction and space savings by forming a conductive and durable circuit body directly on the resin casing, while maintaining design versatility and flexibility.
Implementation Method 1
a conductive portion of the circuit body is formed by spraying a first layer onto a surface of the resin casing by a cold spray method in which metal powder and inert gas are sprayed onto an object
Data Source
AI summary
A conductive portion of a circuit body is formed by performing spraying on a surface of a resin casing. For spraying of the conductive portion, a cold spray method in which metal powder and inert gas are sprayed to an object is used. A circuit component is mounted on the conductive portion. Each terminal portion of the conductive portion is provided with a connector for connection with an external circuit body. An insulating resin is laminated on a surface of the conductive portion. The circuit body is directly formed on the surface of the resin casing by a series of processes described above.