Collective LED Manufacturing via Substrate Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The individual handling of each light-emitting diode (LED) during manufacturing processes, such as contact pad formation and assembly, increases costs and production time due to the need for precise but labor-intensive operations.
Innovation Solution
A method for collective manufacturing of LEDs, where multiple elemental structures are formed on a substrate with trenches, allowing for simultaneous formation of n-type and p-type contact pads, followed by bonding with a second substrate, enabling efficient wiring and assembly of multiple LEDs in fewer steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If individual handling of each LED is performed during manufacturing operations such as contact pad formation and assembly, then manufacturing precision is improved, but productivity deteriorates and manufacturing costs increase
Solution Approach 1:
Multiple elemental LED structures are arranged on a common substrate and processed collectively in a single batch. Contact pads are formed simultaneously for all LEDs using one deposition step, and assembly operations are performed on the entire array at once, merging individual operations into a collective process that maintains precision while dramatically improving productivity
Solution Approach 2:
The substrate serves multiple functions: it acts as a support structure during manufacturing, provides a platform for collective processing, and enables simultaneous access to multiple LED structures. This universal platform allows the same equipment and processes to be applied to all LEDs at once, eliminating the need for repeated individual handling
2Manufacturing precision
If individual handling of each LED is performed during manufacturing operations, then manufacturing precision is improved, but device complexity increases due to multiple separate operations
Solution Approach 1:
Multiple discrete manufacturing operations that would normally be performed separately on individual LEDs are merged into single collective operations. For example, contact pad formation for all LEDs is achieved in one deposition step rather than multiple separate steps, reducing the total number of operations and simplifying the manufacturing process
Solution Approach 2:
The substrate is segmented into multiple zones corresponding to individual LED structures, allowing collective processing while maintaining the ability to address each LED individually when needed. This segmentation enables the system to function both as a unified array for batch operations and as individual units for precision work
3Manufacturing precision
If contact pads are formed independently on each elemental structure, then manufacturing precision is improved, but the number of operations increases and costs rise
Solution Approach 1:
Contact pad formation operations are merged into a single collective process where all contact pads are deposited simultaneously across the entire substrate using one coating step. This eliminates the need to repeat the deposition process for each LED individually, significantly reducing material costs, equipment usage, and manufacturing complexity while maintaining consistent precision across all pads
4Manufacturing precision
If individual assembly operations are performed for each LED, then assembly precision is improved, but productivity deteriorates
Solution Approach 1:
Assembly operations are performed on the entire array of LED structures simultaneously rather than one at a time. The substrate enables collective manipulation and positioning of multiple LEDs in a single operation, maintaining precise alignment through the rigid substrate support while achieving high-speed assembly that would be impossible with sequential individual handling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of operations required for contact pad formation and assembly, lowering costs and production times while enabling the collective preparation of LEDs with integrated substrates and light-converting materials.
Implementation Method 1
deposition of a conductive material layer on the whole of the surface of the first substrate comprising the elemental LED structures and polishing of the conductive material layer
Implementation Method 2
bonding by molecular adhesion of a second substrate on the polished surface of said structure
Data Source
AI summary
The invention relates to a method of collective manufacturing of light-emitting diode (LED) devices comprising formation of elemental structures (150) each comprising an n- type layer (132), an active layer (133) and a p-type layer (134), the method comprising: - reduction of the lateral dimensions of part of each elemental LED structure (150); - formation of a portion of insulating material (139) on the sides of the elemental structures (150); - formation of n-type electrical contact pads (145) and p-type electrical contact pads (138); - deposition of a conductive material layer (141) on the elemental structures (150) and polishing of the conductive material layer (141); and - bonding by molecular adhesion of a second substrate (50) on the polished surface (70a) of said structure (70).